IBM Intel Xeon E5606 49Y3775 User Manual
Product codes
49Y3775
Thermal Specifications
128
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
2.
Implementation of the nominal and short-term Thermal Profiles should result in virtually no TCC activation.
Utilization of thermal solutions that do not meet the Thermal Profile will result in increased probability of
TCC activation and may incur measurable performance loss.
3.
The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4.
The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances
per year, as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durations
exceeding 360 hours per year violate the processor thermal specifications and may result in permanent
damage to the processor.
5.
Refer to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guidelines for system
and environmental implementation details.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
Power specifications are defined at all VIDs found in
. The processor may be shipped under
multiple VIDs for each frequency.
4.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 7-17. LV-60W Processor Dual Thermal Profile
Power (W)
Nominal T
CASE_MAX
(C)
Maximum T
CASE_MAX
(C)
0
52
67
10
55
70
20
58
73
30
61
76
40
64
79
50
67
82
60
70
85
Table 7-18. LV-40W Processor Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
40
5
1, 2, 3, 4