Motorola Mobility LLC T56KT1 User Manual

Page of 116
G30 Mounting
76
 G30 - Module Hardware Description
December 15, 2009
http://www.hirose.co.jp/cataloge_hp/e32119372.pdf
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G30 Mounting
Note:
This section applies to G30 70 pin connector Model only.
The G30 incorporates 2 mechanical holes for installing the module onto the application board. 
The holes are 2.4 millimeters in diameter, which accommodates several types of mechanical 
elements.
Several mechanical approaches may be applied to mount and fasten G30 to the application board. 
Using M2 screws with suitable washers to mount the module onto spacers, a bracket or chassis is 
a recommended design.
Special attention must be paid to the area surrounding the G30 mounting holes. A grounding pad 
of 4.4 millimeters in diameter surrounds these holes. The diameter and area of this pad must not 
be exceeded by any mechanical or electrical element. Several electrical components, which are 
not shielded, are located near the holes. These components must not be in contact with the 
mounting elements or with other parts of the application board, and care must be taken to avoid 
any damage.
 depict the G30 mounting area.
Figure 4-8: G30 Mounting Area
The holes are used for mechanical mounting of G30 to the application board but also for 
grounding support. Using conductive elements to install G30, significantly improves the overall 
grounding of the module and therefore improves the G30 performance and stability.
It is required to use screws or other mechanical elements to fasten G30 to the application board, 
but it is highly recommended to use conductive elements to improve the module's performance.
The preferred mounting screw head types are:
• "Allen" head with a champer - the best choice.
• "Star" head - good.
• "Philips" head - may cause damage to nearby components.