Intel III Xeon 800 MHz 80526KZ800256 User Manual
Product codes
80526KZ800256
THERMAL SPECIFICATIONS
56
Table 47 Power Estimates
1
Frequency Core
Power
2
(W)
2.8V
OCVR
Power (W)
5V/12V
OCVR
Power (W)
2.8V
Cartridge
Power
3
(W)
5V/12V
Cartridge
Power
3
(W)
2.8V
Thermal
Power
4,8
(W)
5V/12V
Thermal
Power
4,8
(W)
AGTL+
Power
5
Min
Tplate
°°°°C
Max
Tplate
°°°°C
700/100
25.9 6.1 7.3 32.0 33.2
28.9
29.6 2 0 65
900/100
31.8 7.5 9.0 39.3 40.8
35.5
36.3 2 0 65
FMB
6
50 50 0 65
NOTES:
1.
These values are specified at nominal
VCC_CORE
for the processor core with integrated L2 cache.
2.
Core power indicates the combined worst-case power that can be dissipated by the processor & L2 cache. This value
will be determined after the product has been characterized.
will be determined after the product has been characterized.
3.
Cartridge power indicates the worst-case power that can be dissipated by the processor, L2 cache and the OCVR. It is
not possible for the AGTL+ bus, and the processor core to all be at full power simultaneously.
not possible for the AGTL+ bus, and the processor core to all be at full power simultaneously.
4.
Thermal power (which OEM’s should use for their thermal designs) indicates the worst-case power that can be
dissipated by the processor, L2 cache and 50% of the OCVR (since the OCVR does not contact the Thermal Plate).
De-rating the thermal design power may result in exceeding the Tplate maximum temperature specification,
which may result in immediate system failure or degradation of the processor’s functional lifetime.
dissipated by the processor, L2 cache and 50% of the OCVR (since the OCVR does not contact the Thermal Plate).
De-rating the thermal design power may result in exceeding the Tplate maximum temperature specification,
which may result in immediate system failure or degradation of the processor’s functional lifetime.
5.
AGTL+ power is the worst-case power dissipated in the termination resistors for the AGTL+ bus.
6.
"FMB" is a suggested design guideline for a flexible motherboard design.
7.
A disabled processor OCVR draws approximately 46 mA at 2.8V V
CC
_
CORE
from the motherboard VRM. If your system
needs to maintain VRM regulation with a disabled processor (OCVR_EN inactive), the VRM output minimum load
specification should be 46 mA or less.
specification should be 46 mA or less.
8.
The Thermal Power specifications have been recently redefined. These values are based
on device characterization
and do not reflect any silicon design changes to lower processor power consumption. Absolute power consumption has
not changed; however, the maximum thermal power specifications are being updated to reflect actual silicon
performance. The Thermal Power values represent the thermal design point required to cool the processor in the
platform environment.
not changed; however, the maximum thermal power specifications are being updated to reflect actual silicon
performance. The Thermal Power values represent the thermal design point required to cool the processor in the
platform environment.