Intel III Xeon 800 MHz 80526KZ800256 User Manual
Product codes
80526KZ800256
THERMAL SPECIFICATIONS
57
6.1.2 PLATE
FLATNESS
SPECIFICATION
The thermal plate flatness for the processor is specified to 0.010” across the entire thermal plate surface, with
no more than a 0.003” step anywhere on the surface of the plate, as shown in Figure 18.
no more than a 0.003” step anywhere on the surface of the plate, as shown in Figure 18.
Figure 18. Plate Flatness Reference
6.2 Processor Thermal Analysis
6.2.1
THERMAL SOLUTION PERFORMANCE
Processor cooling solutions should attach to the thermal plate. The processor cover is not designed for
thermal solution attachment.
The complete thermal solution must adequately control the thermal plate below the maximum and above the
minimum specified in Table 47 and 48. The performance of any thermal solution is defined as the thermal
resistance between the thermal plate and the ambient air around the processor (
thermal solution attachment.
The complete thermal solution must adequately control the thermal plate below the maximum and above the
minimum specified in Table 47 and 48. The performance of any thermal solution is defined as the thermal
resistance between the thermal plate and the ambient air around the processor (
θ
thermal plate to ambient).
The lower the thermal resistance between the thermal plate and the ambient air, the more efficient the thermal
solution is. The required
solution is. The required
θ thermal plate to ambient is dependent upon the maximum allowed thermal plate
temperature (TPLATE), the local ambient temperature (TLA) and the thermal plate power (PPLATE).
θ thermal plate to ambient = (TPLATE – TLA) / PPLATE
The maximum TPLATE and the thermal plate power are listed in Table 47 and 48. TLA is a function of the
system design. Table 49 provides the example of a resultant thermal solution performance for the processor
at different ambient air temperatures around the processor.
Table 49. Example Thermal Solution Performance
Thermal Solution Performance
Local Ambient Temperature (T
LA
)
FMB (50 Watts)
θ thermal plate to ambient
35°C 40°C 45°C
(°C/watt)
0.60 0.50 0.40
Theta thermal plate to ambient value is made up of two primary components: the thermal resistance between
the thermal plate and heatsink (theta
θ thermal plate to heatsink) and the thermal resistance between the
heatsink and ambient air around the processor (theta
θ heatsink to air). A critical, but controllable factor to
decrease the resultant value of theta thermal plate to heatsink is management of the thermal interface
between the thermal plate and heatsink. The other controllable factor (theta
between the thermal plate and heatsink. The other controllable factor (theta
θ heatsink to air) is determined by