Intel III Xeon 800 MHz 80526KZ800256 User Manual
Product codes
80526KZ800256
THERMAL SPECIFICATIONS
59
To ensure functional and reliable processor operation, the processor's thermal plate temperature (TPLATE)
must be maintained at or below the maximum TPLATE and at or above the minimum TPLATE specified in
Table 47 and 48. Power from the processor core is transferred to the thermal plate at 2 locations. Figure 20
and 21 shows the locations for TPLATE measurement directly above these transfer locations. Thermocouples
are used to measure TPLATE and special care is required to ensure an accurate temperature measurement.
Before taking any temperature measurements, the thermocouples must be calibrated. When measuring the
temperature of a surface, errors can be introduced in the measurement if not handled properly. Such
measurement errors can be due to a poor thermal contact between the thermocouple junction and the
measured surface, conduction through thermocouple leads, heat loss by radiation and convection, or by
contact between the thermocouple cement and the heatsink base. To minimize these errors, the following
approach is recommended:
•
must be maintained at or below the maximum TPLATE and at or above the minimum TPLATE specified in
Table 47 and 48. Power from the processor core is transferred to the thermal plate at 2 locations. Figure 20
and 21 shows the locations for TPLATE measurement directly above these transfer locations. Thermocouples
are used to measure TPLATE and special care is required to ensure an accurate temperature measurement.
Before taking any temperature measurements, the thermocouples must be calibrated. When measuring the
temperature of a surface, errors can be introduced in the measurement if not handled properly. Such
measurement errors can be due to a poor thermal contact between the thermocouple junction and the
measured surface, conduction through thermocouple leads, heat loss by radiation and convection, or by
contact between the thermocouple cement and the heatsink base. To minimize these errors, the following
approach is recommended:
•
Use 36 gauge or finer diameter K, T, or J type thermocouples. Intel's laboratory testing was done using a
thermocouple made by Omega* (part number: 5TC-TTK-36-36).
thermocouple made by Omega* (part number: 5TC-TTK-36-36).
•
Attach each thermocouple bead or junction to the top surface of the thermal plate at the locations
specified in Figure 19 using high thermal conductivity cements.
specified in Figure 19 using high thermal conductivity cements.
•
A thermocouple should be attached at a 0° angle if no heatsink is attached to the thermal plate. If a
heatsink is attached to the thermal plate but the heatsink does not cover the location specified for
TPLATE measurement, the thermocouple should be attached at a 0° angle (refer to Figure 20).
heatsink is attached to the thermal plate but the heatsink does not cover the location specified for
TPLATE measurement, the thermocouple should be attached at a 0° angle (refer to Figure 20).
•
The thermocouple should be attached at a 90° angle if a heatsink is attached to the thermal plate and the
heatsink covers the location specified for TPLATE measurement (refer to Figure 21).
heatsink covers the location specified for TPLATE measurement (refer to Figure 21).
•
The hole size through the heatsink base to route the thermocouple wires out should be smaller than
0.150" in diameter.
0.150" in diameter.
•
Make sure there is no contact between the thermocouple cement and heatsink base. This contact will
affect the thermocouple reading.
affect the thermocouple reading.
000899
Figure 20. Technique for Measuring T
PLATE
with 0° Angle Attachment
000900
Figure 21. Technique for Measuring T
PLATE
with 90° Angle Attachment