Intel III 450 MHz 80525PY450512 Data Sheet
Product codes
80525PY450512
Datasheet
49
Thermal Specifications and Design Considerations
4.0
Thermal Specifications and Design Considerations
Limited quantities of Pentium III processors utilize S.E.C.C. package technology. This technology
uses an extended thermal plate for heatsink attachment. The extended thermal plate interface is
intended to provide accessibility for multiple types of thermal solutions. The majority of SC242-
based Pentium III processors use S.E.C.C.2 packaging technology. S.E.C.C.2 package technology
does not incorporate an extended thermal plate.
uses an extended thermal plate for heatsink attachment. The extended thermal plate interface is
intended to provide accessibility for multiple types of thermal solutions. The majority of SC242-
based Pentium III processors use S.E.C.C.2 packaging technology. S.E.C.C.2 package technology
does not incorporate an extended thermal plate.
This chapter provides needed data for designing a thermal solution. However, for the correct
thermal measuring processes, refer to AP-905, Intel
thermal measuring processes, refer to AP-905, Intel
®
Pentium
®
III Processor Thermal Design
Guidelines (Document Number 245087).
provides a 3-dimensional view of an S.E.C.C. package. This figure illustrates the thermal
provides a substrate view of an S.E.C.C.2 package.
Figure 18. S.E.C.Cartridge — 3-Dimensional View
Right Latch
Left Latch
Cover
Extended Thermal Plate