Intel III 450 MHz 80525PY450512 Data Sheet
Product codes
80525PY450512
50
Datasheet
Thermal Specifications and Design Considerations
4.1
Thermal Specifications
provide the thermal design power dissipation and maximum and minimum
temperatures for Pentium III processors with S.E.C.C. and S.E.C.C.2 package technologies
respectively. While the processor core dissipates the majority of the thermal power, thermal power
dissipated by the L2 cache also impacts the overall processor power specification. This total
thermal power is referred to as processor power in the following specifications. Systems should
design for the highest possible processor power, even if a processor with a lower thermal
dissipation is planned.
respectively. While the processor core dissipates the majority of the thermal power, thermal power
dissipated by the L2 cache also impacts the overall processor power specification. This total
thermal power is referred to as processor power in the following specifications. Systems should
design for the highest possible processor power, even if a processor with a lower thermal
dissipation is planned.
NOTES:
1. These values are specified at nominal V
CCCORE
for the processor core and nominal V
CCL2
/V
CC3.3
for the L2
cache (if applicable).
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus
termination. The maximum power for each of these components does not occur simultaneously.
3. Extended Thermal Plate power is the processor power that is dissipated through the extended thermal plate.
Figure 19. S.E.C.Cartridge 2 — Substrate View
Substrate View
OLGA Package
L2 Cache
(CPUID 067xh Only
(CPUID 067xh Only
Table 25. Thermal Specifications for S.E.C.C. Packaged Processors
1
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(KBs)
Processor
Power
2
(W)
Extended
Thermal
Plate Power
3
(W)
Min
T
PLATE
(°C)
Max
T
PLATE
(°C)
Min
T
COVER
(°C)
Max
T
COVER
(°C)
450 512
25.3
25.5
5
70
5
75
500 512
28.0
28.2
5
70
5
75