Intel Phi 7120A SC7120A Data Sheet
Product codes
SC7120A
Intel
®
Xeon Phi™ Coprocessor Datasheet
Document ID Number: 328209 003EN
22
If the system is able to provide a temperature lower than 45
o
C at the card inlet, then
the total airflow can be reduced according to the graph and table in
If the 5110P SKU is powered by a 2x4 and a 2x3 connector, the card can support an
additional 20W of power for maximum TDP of 245W (see
additional 20W of power for maximum TDP of 245W (see
for more
details). In this case, the corresponding airflow requirement for cooling the part as a
245W card is shown in
245W card is shown in
3.3.2.2
Airflow Requirement for SE10P/7120P/3120P/31S1P Passive Cooling
Solution
In order to ensure adequate cooling of the SE10P/7120P/3120P 300W and 31S1P
270W SKUs with a 45
270W SKUs with a 45
o
C inlet temperature, the system must be able to provide 33 ft
3
/
min of airflow to the card with 7.2 ft
3
/min on the secondary side and the remainder on
the primary side. The total pressure drop (assuming a multi-card installation conform-
ing to the PCI Express* mechanical specification) is 0.54 in H
ing to the PCI Express* mechanical specification) is 0.54 in H
2
O at this flow rate.
If the system is able to provide a temperature lower than 45
o
C at the card inlet, then
the total airflow can be reduced according to the graph and table in