Intel Phi 7120A SC7120A Data Sheet

Document ID Number: 328209 003EN

Intel

®

 Xeon Phi™ Coprocessor Datasheet

21

For the passive heat sink on the 7120P/SE10P/5110P/3120P/31S1P SKUs, the Intel

®

 

Xeon Phi™ coprocessor thermal & mechanical solution also utilizes a 'fuselage/
supersink' approach. 

 illustrates the key components of the passive design.

As in the active thermal solution, the duct is metallic and performs both structural and 
thermal roles. In its 'fuselage' function, the duct provides structural support for the 
forces generated by the CPU thermal interface, protects against shock events, and 
channels airflow through the card. In its 'supersink' function, the duct contains internal 
fins and heat pipes. The internal heat pipes serve to transmit heat from GDDR (both 
top- and bottom-side) and VR components to the internal fin banks, diecast blower 
frame, and metal fuselage structure where it can be effectively transferred to the 
airstream. The passive solution does not have a diecast blower frame as it relies upon 
forced airflow from the host system. In place of the blower and frame, an additional fin 
bank is added to dissipate waste heat from GDDR and VR components. The fin spacing 
of all fin banks as well as of the CPU heat sink fin bank have been optimized for 
receiving system-supplied airflow. A backplate stiffener/heat sink is used.

In order to ensure adequate cooling of the 5110P SKUs with a 45

o

C inlet temperature, 

the system must be able to provide 20 ft

3

/min of airflow to the card with 4.3 ft

3

/min on 

the secondary side and the remainder on the primary side. The total pressure drop 
(assuming a multi-card installation conforming to the PCI Express* mechanical 
specification) is 0.21 inch H

2

O at this flow rate.

For systems with reversed airflow, the corresponding airflow requirement is expected 

to be within +/-5% tolerance of the values shown in the following tables.