Intel Phi 7120A SC7120A Data Sheet

Intel

®

 Xeon Phi™ Coprocessor Datasheet

Document ID Number: 328209 003EN

20

For the 3120A and 7120A SKUs, the Intel

®

 Xeon Phi™ coprocessor thermal-mechanical 

solution utilizes a supersink approach in which a primary heatsink is used to cool the 
coprocessor while a metallic fuselage/supersink cools the VR and GDDR components. 

 illustrates the key components of the active cooling design.

In the fuselage/supersink approach, the duct is metallic and performs both structural 
and thermal roles. In its 'fuselage' function, the duct provides structural support for the 
forces generated by the coprocessor thermal interface, protects against shock events, 
and channels airflow through the card. In its 'supersink' function, the duct contains 
internal fins, heat pipes, and diecast blower frame. The internal heat pipes serve to 
transmit heat from GDDR (both top- and bottom-side) and VR components to the 
internal fin banks, diecast blower frame, and metal fuselage structure where it can be 
effectively transferred to the airstream. The duct also contains horizontal webs which 
interface to the east and west GDDR as well as to the VR FETs. Together, these 
structures dissipate heat lost from the GDDR and VR components into the air.

The coprocessor thermal path is separated from the GDDR and VR components, and 
utilizes a heatsink with parallel plate fins and vapor chamber base.

The active solution also contains a high-performance dual-intake blower that operates 
up to 5400 rpm at 20W of motor power. The blower has been designed to maximize the 
pressure drop capability and is able to deliver up to 35 ft

3

/min in an open airflow 

environment. When installed on the card, the blower delivers 31 ft

3

/min with no 

adjacent blockage. When an adjacent card is considered, the resultant impedance loss 
causes the flow rate to drop to 23 ft

3

/min. The active thermal solution is designed to 

provide sufficient cooling even in the latter scenario.