Intel Phi 7120A SC7120A Data Sheet

Product codes

SC7120A

Intel

Xeon Phi™ Coprocessor Datasheet

Document ID Number: 328209 003EN

Table 3-3

shows thermal specifications of components present on the SE10X/7120X

and 7120D/5120D boards.

3.4.1.1

VR Temperature and Thermal Throttling

Some thermal sensors on the coprocessor are located in the field of the VR inductors
and FETs that drive power to the coprocessor silicon, GDDR and other circuitry
(

Figure 3-15

). These sensors continuously monitor the temperature of the circuit

board. If the temperature reaches or exceeds 105° C, an interrupt will be sent to the
SMC. In response to this interrupt, the SMC will assert PROCHOT to the coprocessor
which in turn will force the coprocessor frequency to drop to the minimum supported
value (approximately 600MHz). This frequency drop will reduce the power dissipation
of the card and should allow the VR components to cool down. Once the temperature
has dropped below 105° C, the VR controller will send a message to the SMC to de-
assert PROCHOT. This will allow the coprocessor to return to the normal high frequency
operating point.

Table 3-3.

Component Thermal Specification on SE10X/7120X and 7120D/5120D

Component

Thermal specification

Coprocessor

case

≤

95°C

GDDR

case

≤

85°C

VR FET

junction

≤

150°C

VR Inductor

body

≤

100°C

Notes:

1. While this is the component specification, on the passive and active Intel® Xeon Phi™ coprocessor

products, the junction temperature is limited to 135

°C

in order to prevent damage to the PCB.

Figure 3-15 7120D/5120D VR Thermal Sensors for Custom Cooling Consideration

Intel Xeon Phi

Coprocessor

Silicon

VR thermal
sensor