Intel Phi 7120A SC7120A Data Sheet
Product codes
SC7120A
Document ID Number: 328209 003EN
Intel
®
Xeon Phi™ Coprocessor Datasheet
33
3.4.2
Thermal Profile and Cooling
The simplest cooling mechanism would involve running fans at full speed. For those
custom air-cooled solutions that intend to be economical in fan power usage and
acoustics,
custom air-cooled solutions that intend to be economical in fan power usage and
acoustics,
represents three regions on the SE10X/7120X coprocessor
power consumption curve relevant to system fan control.
Region (A-B) on the line represents the minimum necessary performance of a cooling
solution to keep the coprocessor silicon temperature (T
solution to keep the coprocessor silicon temperature (T
junction
) below T
throttle
of 104
°
C
(
), during high power dissipation. In this region, a cooling solution based on
airflow would ensure the fans are operating at 100% capacity. In region B-C, the
coprocessor power consumption is low enough that the cooling solution may be set to
maintain the junction temperature at a target temperature. Finally, in region C-D, the
coprocessor may need to be cooled to below the target temperature to maintain a
reasonable exhaust air temperature.
coprocessor power consumption is low enough that the cooling solution may be set to
maintain the junction temperature at a target temperature. Finally, in region C-D, the
coprocessor may need to be cooled to below the target temperature to maintain a
reasonable exhaust air temperature.
Figure
shows the analogous thermal behavior of T
case
.
Figure 3-16 SE10X/7120X SKU Coprocessor Junction Temperature (T
junction)
vs Power
45.0
55.0
65.0
75.0
85.0
95.0
105.0
0
50
100
150
200
Temperature (
o
C)
Intel® Xeon Phi™ Coprocessor Si Power (W)
T
junction
A 104°C
B
C
D