Microchip Technology IC PIC MCU PIC18F65J15-I/PT TQFP-64 MCP PIC18F65J15-I/PT Data Sheet
Product codes
PIC18F65J15-I/PT
PIC18F87J10 FAMILY
DS39663F-page 30
© 2009 Microchip Technology Inc.
2.6
External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency secondary oscillator (refer to
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator
circuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a
two-sided board, avoid any traces on the other side of
the board where the crystal is placed. A suggested
layout is shown in Figure 2-4.
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
oscillators: a high-frequency primary oscillator and a
low-frequency secondary oscillator (refer to
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator
circuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a
two-sided board, avoid any traces on the other side of
the board where the crystal is placed. A suggested
layout is shown in Figure 2-4.
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC™ and PICmicro
®
Devices”
• AN849, “Basic PICmicro
®
Oscillator Design”
• AN943, “Practical PICmicro
®
Oscillator Analysis
and Design”
• AN949, “Making Your Oscillator Work”
FIGURE 2-4:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
OF THE OSCILLATOR
CIRCUIT
2.7
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 kΩ
to 10 kΩ resistor to V
driven to a logic low state. Alternatively, connect a 1 kΩ
to 10 kΩ resistor to V
SS
on unused pins and drive the
output to logic low.
13
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
14
15
16
17
18
19
20