Microchip Technology MA330025-1 Data Sheet
dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
DS70616G-page 500
2009-2012 Microchip Technology Inc.
32.1
DC Characteristics
TABLE 32-1:
OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD
Range
(in Volts)
Temp Range
(in °C)
Maximum MIPS
dsPIC33EPXXX(GP/MC/MU)806/810/
814 and PIC24EPXXX(GP/GU)810/814
—
2.95V-3.6V
(
)
-40°C to +85°C
70
—
2.95V-3.6V
(
)
-40°C to +125°C
60
Note 1: Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules: ADC, Comparator and DAC will have
degraded performance. Device functionality is tested but not characterized. Refer to Parameter
for the minimum and maximum BOR values.
TABLE 32-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min.
Typ.
Max.
Unit
Industrial Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Extended Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+140
°C
Operating Ambient Temperature Range
T
A
-40
—
+125
°C
Power Dissipation:
Internal chip power dissipation:
Internal chip power dissipation:
P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O =
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
– T
A
)/
JA
W
TABLE 32-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ.
Max.
Unit
Notes
Package Thermal Resistance, 64-pin QFN (9x9 mm)
JA
28
—
°C/W
Package Thermal Resistance, 64-pin TQFP (10x10 mm)
JA
47
—
°C/W
Package Thermal Resistance, 100-pin TQFP (12x12 mm)
JA
43
—
°C/W
Package Thermal Resistance, 100-pin TQFP (14x14 mm)
JA
43
—
°C/W
Package Thermal Resistance, 121-pin TFBGA (10x10 mm)
JA
40
—
°C/W
Package Thermal Resistance, 144-pin LQFP (20x20 mm)
JA
33
—
°C/W
Package Thermal Resistance, 144-pin TQFP (16x16 mm)
JA
33
—
°C/W
Note 1: Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.