Microchip Technology TDGL019 Data Sheet
PIC32MX1XX/2XX
DS60001168F-page 246
© 2011-2014 Microchip Technology Inc.
29.1
DC Characteristics
TABLE 29-1:
OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD
Range
(in Volts)
(1)
Temp. Range
(in °C)
Max. Frequency
PIC32MX1XX/2XX
DC5
2.3-3.6V
-40°C to +85°C
40 MHz
DC5b
2.3-3.6V
-40°C to +105°C
40 MHz
Note 1:
Overall functional device operation at V
BORMIN
< V
DD
< V
DDMIN
is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below V
DDMIN
. Refer to
for BOR values.
TABLE 29-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min.
Typical
Max.
Unit
Industrial Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
V-temp Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+140
°C
Operating Ambient Temperature Range
T
A
-40
—
+105
°C
Power Dissipation:
Internal Chip Power Dissipation:
Internal Chip Power Dissipation:
P
INT
= V
DD
x (I
DD
– S I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O = S (({V
DD
– V
OH
} x I
OH
) + S (V
OL
x I
OL
))
Maximum Allowed Power Dissipation
P
DMAX
(T
J
– T
A
)/
θ
JA
W
TABLE 29-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristics
Symbol Typical
Max.
Unit
Notes
Package Thermal Resistance, 28-pin SSOP
θ
JA
71
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θ
JA
50
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
θ
JA
42
—
°C/W
1
Package Thermal Resistance, 28-pin QFN
θ
JA
35
—
°C/W
1
Package Thermal Resistance, 36-pin VTLA
θ
JA
31
—
°C/W
1
Package Thermal Resistance, 44-pin QFN
θ
JA
32
—
°C/W
1
Package Thermal Resistance, 44-pin TQFP
θ
JA
45
—
°C/W
1
Package Thermal Resistance, 44-pin VTLA
θ
JA
30
—
°C/W
1
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
θ
JA
) numbers are achieved by package simulations.