Microchip Technology DM164134 Data Sheet
© 2006 Microchip Technology Inc.
DS41159E-page 379
PIC18FXX8
29.2
Package Details
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
http://www.microchip.com/packaging
15
10
5
15
10
5
β
Mold Draft Angle Bottom
15
10
5
15
10
5
α
Mold Draft Angle Top
10.92
8.89
8.13
.430
.350
.320
eB
Overall Row Spacing
§
0.56
0.48
0.41
.022
.019
.016
B
Lower Lead Width
1.65
1.33
1.02
.065
.053
.040
B1
Upper Lead Width
0.38
0.29
0.20
.015
.012
.008
c
Lead Thickness
3.43
3.30
3.18
.135
.130
.125
L
Tip to Seating Plane
35.18
34.67
34.16
1.385
1.365
1.345
D
Overall Length
7.49
7.24
6.99
.295
.285
.275
E1
Molded Package Width
8.26
7.87
7.62
.325
.310
.300
E
Shoulder to Shoulder Width
0.38
.015
A1
Base to Seating Plane
3.43
3.30
3.18
.135
.130
.125
A2
Molded Package Thickness
4.06
3.81
3.56
.160
.150
.140
A
Top to Seating Plane
2.54
.100
p
Pitch
28
28
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
n
E1
c
eB
β
E
α
p
L
A2
B
B1
A
A1
Notes:
JEDEC Equivalent: MO-095
Drawing No. C04-070
Drawing No. C04-070
* Controlling Parameter
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
§ Significant Characteristic