Microchip Technology DM164134 Data Sheet

© 2006 Microchip Technology Inc.

DS41159E-page 381

For the most current package drawings, please see the Microchip Packaging Specification located at 
http://www.microchip.com/packaging

15

10

5

15

10

5

β

Mold Draft Angle Bottom

15

10

5

15

10

5

α

Mold Draft Angle Top

17.27

16.51

15.75

.680

.650

.620

eB

Overall Row Spacing

0.56

0.46

0.36

.022

.018

.014

B

Lower Lead Width

1.78

1.27

0.76

.070

.050

.030

B1

Upper Lead Width

0.38

0.29

0.20

.015

.012

.008

c

Lead Thickness

3.43

3.30

3.05

.135

.130

.120

L

Tip to Seating Plane

52.45

52.26

51.94

2.065

2.058

2.045

D

Overall Length

14.22

13.84

13.46

.560

.545

.530

E1

Molded Package Width

15.88

15.24

15.11

.625

.600

.595

E

Shoulder to Shoulder Width

0.38

.015

A1

Base to Seating Plane

4.06

3.81

3.56

.160

.150

.140

A2

Molded Package Thickness

4.83

4.45

4.06

.190

.175

.160

A

Top to Seating Plane

2.54

.100

p

Pitch

40

40

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

A2

1

2

D

n

E1

c

β

eB

E

α

p

L

B

B1

A

A1

Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. 
JEDEC Equivalent:  MO-011
Drawing No. C04-016

 Significant Characteristic