Intel III Xeon 900 MHz 80526KY9002M Data Sheet
Product codes
80526KY9002M
PENTIUM® III XEON™ PROCESSOR AT 600 MHz to 1 GHz with 256KB L2 Cache
THERMAL SPECIFICATIONS
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6. THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS
The Pentium® III Xeon™ processor at 600 MHz+ will use a thermal plate for heat sink attachment. The
thermal plate interface is intended to provide for multiple types of thermal solutions. This chapter will provide
the necessary data for a thermal solution to be developed. See Figure 17 for thermal plate location.
thermal plate interface is intended to provide for multiple types of thermal solutions. This chapter will provide
the necessary data for a thermal solution to be developed. See Figure 17 for thermal plate location.
Figure 17. Thermal Plate View
6.1 Thermal Specifications
This section provides power dissipation specifications for each variation of the Pentium III Xeon processor at
600 MHz+. The thermal plate flatness is also specified for the S.E.C. cartridge.
600 MHz+. The thermal plate flatness is also specified for the S.E.C. cartridge.
6.1.1
POWER DISSIPATION
Table 42 provides the thermal design power dissipation for Pentium III Xeon processor at 600 MHz+. While
the processor core dissipates the majority of the thermal power, the system designer should also be aware of
the thermal power dissipated by the OCVR. Systems should design for the highest possible thermal power,
even if a processor with lower frequency is planned. The thermal plate is the attach location for all thermal
solutions. The maximum temperature for the entire thermal plate surface is shown in Table 42.
the processor core dissipates the majority of the thermal power, the system designer should also be aware of
the thermal power dissipated by the OCVR. Systems should design for the highest possible thermal power,
even if a processor with lower frequency is planned. The thermal plate is the attach location for all thermal
solutions. The maximum temperature for the entire thermal plate surface is shown in Table 42.
The processor power is dissipated through the thermal plate and other paths. The power dissipation is a
combination of power from the OCVR, the processor core (with integrated L2 Cache), and the AGTL+ bus
termination resistors. The overall system thermal design must comprehend the Max Thermal power. The
combined power from the processor core, including the second level cache, and the OCVR that dissipates
through the thermal plate is the Max Thermal power. The heat sink should be designed to dissipate the Max
Thermal power.
combination of power from the OCVR, the processor core (with integrated L2 Cache), and the AGTL+ bus
termination resistors. The overall system thermal design must comprehend the Max Thermal power. The
combined power from the processor core, including the second level cache, and the OCVR that dissipates
through the thermal plate is the Max Thermal power. The heat sink should be designed to dissipate the Max
Thermal power.
The thermal sensor feature of the processor cannot be used to measure TPLATE. The TPLATE specification
must be met regardless of the reading of the processor's thermal sensor in order to ensure adequate cooling
for the entire Pentium III Xeon processor at 600 MHz+.
must be met regardless of the reading of the processor's thermal sensor in order to ensure adequate cooling
for the entire Pentium III Xeon processor at 600 MHz+.