Intel III Xeon 900 MHz 80526KY9002M Data Sheet
Product codes
80526KY9002M
PENTIUM® III XEON™ PROCESSOR AT 600 MHz to 1 GHz with 256KB L2 Cache
THERMAL SPECIFICATIONS
55
6.1.2
PLATE FLATNESS SPECIFICATION
The thermal plate flatness for the Pentium® III Xeon™ processor at 600 MHz+ is specified to 0.010” across
the entire thermal plate surface, with no more than a 0.003” step anywhere on the surface of the plate, as
shown in Figure 18.
the entire thermal plate surface, with no more than a 0.003” step anywhere on the surface of the plate, as
shown in Figure 18.
Figure 18. Plate Flatness Reference
6.2 Processor Thermal Analysis
6.2.1
THERMAL SOLUTION PERFORMANCE
Processor cooling solutions should attach to the thermal plate. The processor cover is not designed for
thermal solution attachment.
thermal solution attachment.
The complete thermal solution must adequately control the thermal plate below the maximum and above the
minimum specified in Table 42. The performance of any thermal solution is defined as the thermal resistance
between the thermal plate and the ambient air around the processor (
minimum specified in Table 42. The performance of any thermal solution is defined as the thermal resistance
between the thermal plate and the ambient air around the processor (
θ
thermal plate to ambient). The lower
the thermal resistance between the thermal plate and the ambient air, the more efficient the thermal solution
is. The required
is. The required
θ thermal plate to ambient is dependent upon the maximum allowed thermal plate
temperature (TPLATE), the local ambient temperature (TLA) and the thermal plate power (PPLATE).
θ
thermal plate to ambient = (TPLATE – TLA) / PPLATE
The maximum TPLATE and the thermal plate power are listed in Table 42. TLA is a function of the system
design. Table 43 provides the example of a resultant thermal solution performance for Pentium III Xeon
processor at 600 MHz+ at different ambient air temperatures around the processor
design. Table 43 provides the example of a resultant thermal solution performance for Pentium III Xeon
processor at 600 MHz+ at different ambient air temperatures around the processor
Table 43. Example Thermal Solution Performance
Thermal Solution Performance
Local Ambient Temperature (T
LA
)
Pentium III Xeon processor at 600 MHz+
FMB (37 watts)
θ thermal plate to ambient
35°C
40°C
45°C
(°C/watt)
0.54
0.40
0.27
Theta thermal plate to ambient value is made up of two primary components: the thermal resistance between
the thermal plate and heat sink (theta
the thermal plate and heat sink (theta
θ thermal plate to heat sink ) and the thermal resistance between the
heat sink and ambient air around the processor (theta
θ heat sink to air). A critical, but controllable factor to
decrease the resultant value of theta thermal plate to heat sink is management of the thermal interface