Intel III Xeon 900 MHz 80526KY9002M Data Sheet
Product codes
80526KY9002M
PENTIUM® III XEON™ PROCESSOR AT 600 MHz to 1 GHz with 256KB L2 Cache
MECHANICAL SPECIFICATIONS
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7. MECHANICAL SPECIFICATIONS
Pentium® III Xeon™ processor at 600 MHz+ uses S.E.C. cartridge package technology. The S.E.C. cartridge
contains the processor core, OCVR and other components. The S.E.C. cartridge package connects to the
baseboard through an edge connector. Mechanical specifications for the processor are given in this section.
See Section 1.1.1 for a complete terminology listing.
contains the processor core, OCVR and other components. The S.E.C. cartridge package connects to the
baseboard through an edge connector. Mechanical specifications for the processor are given in this section.
See Section 1.1.1 for a complete terminology listing.
Figure 22 shows the thermal plate side view and the cover side view of the Pentium III Xeon processor at 600
MHz+. Figure 23 shows the Pentium III Xeon processor at 600 MHz+ S.E.C. cartridge cooling solution
attachment feature details on the thermal plate and depict package form factor dimensions and retention
enabling features of the S.E.C. cartridge. The processor edge connector defined in this document is referred
to as "SC330.1". This connector definition is mechanically the same as the existing SC300. See the SC330
connector specifications for further details on the edge connector.
MHz+. Figure 23 shows the Pentium III Xeon processor at 600 MHz+ S.E.C. cartridge cooling solution
attachment feature details on the thermal plate and depict package form factor dimensions and retention
enabling features of the S.E.C. cartridge. The processor edge connector defined in this document is referred
to as "SC330.1". This connector definition is mechanically the same as the existing SC300. See the SC330
connector specifications for further details on the edge connector.
Table 44 and Table 45 provide the edge finger and SC330.1 connector signal definitions for Pentium III Xeon
processor at 600 MHz+. The signal locations on the SC330 edge connector are to be used for signal routing,
simulation and component placement on the baseboard.
processor at 600 MHz+. The signal locations on the SC330 edge connector are to be used for signal routing,
simulation and component placement on the baseboard.
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Figure 22. Isometric View of S.E.C. Cartridge
NOTES:
(Use of retention holes and retention indents are optional)
11. For SC330 connector specifications, see the SC330 Connector Specification.
12. All dimensions in inches for figures 23 through 28.
12. All dimensions in inches for figures 23 through 28.