Intel III Xeon 900 MHz 80526KY9002M Data Sheet
Product codes
80526KY9002M
PENTIUM® III XEON™ PROCESSOR AT 600 MHz to 1 GHz with 256KB L2 Cache
THERMAL SPECIFICATIONS
57
6.2.3
MEASUREMENTS FOR THERMAL SPECIFICATIONS
6.2.3.1
Plate Temperature Measurement
To ensure functional and reliable processor operation, the processor's thermal plate temperature (TPLATE)
must be maintained at or below the maximum TPLATE and at or above the minimum TPLATE specified in
Table 42. Power from the processor core is transferred to the thermal plate at 2 locations on all Pentium III
Xeon processor at 600 MHz+ products. Figure 20 and 21 shows the locations for TPLATE measurement
directly above these transfer locations. Thermocouples are used to measure TPLATE and special care is
required to ensure an accurate temperature measurement. Before taking any temperature measurements, the
thermocouples must be calibrated. When measuring the temperature of a surface, errors can be introduced in
the measurement if not handled properly. Such measurement errors can be due to a poor thermal contact
between the thermocouple junction and the measured surface, conduction through thermocouple leads, heat
loss by radiation and convection, or by contact between the thermocouple cement and the heat sink base. To
minimize these errors, the following approach is recommended:
must be maintained at or below the maximum TPLATE and at or above the minimum TPLATE specified in
Table 42. Power from the processor core is transferred to the thermal plate at 2 locations on all Pentium III
Xeon processor at 600 MHz+ products. Figure 20 and 21 shows the locations for TPLATE measurement
directly above these transfer locations. Thermocouples are used to measure TPLATE and special care is
required to ensure an accurate temperature measurement. Before taking any temperature measurements, the
thermocouples must be calibrated. When measuring the temperature of a surface, errors can be introduced in
the measurement if not handled properly. Such measurement errors can be due to a poor thermal contact
between the thermocouple junction and the measured surface, conduction through thermocouple leads, heat
loss by radiation and convection, or by contact between the thermocouple cement and the heat sink base. To
minimize these errors, the following approach is recommended:
•
Use 36 gauge or finer diameter K, T, or J type thermocouples. Intel's laboratory testing was done using a
thermocouple made by Omega* (part number: 5TC-TTK-36-36).
thermocouple made by Omega* (part number: 5TC-TTK-36-36).
•
Attach each thermocouple bead or junction to the top surface of the thermal plate at the locations
specified in Figure 19 using high thermal conductivity cements.
specified in Figure 19 using high thermal conductivity cements.
•
A thermocouple should be attached at a 0° angle if no heat sink is attached to the thermal plate. If a heat
sink is attached to the thermal plate but the heat sink does not cover the location specified for TPLATE
measurement, the thermocouple should be attached at a 0° angle (refer to Figure 20).
sink is attached to the thermal plate but the heat sink does not cover the location specified for TPLATE
measurement, the thermocouple should be attached at a 0° angle (refer to Figure 20).
•
The thermocouple should be attached at a 90° angle if a heat sink is attached to the thermal plate and
the heat sink covers the location specified for TPLATE measurement (refer to Figure 21).
the heat sink covers the location specified for TPLATE measurement (refer to Figure 21).
•
The hole size through the heat sink base to route the thermocouple wires out should be smaller than
0.150" in diameter.
0.150" in diameter.
•
Make sure there is no contact between the thermocouple cement and heat sink base. This contact will
affect the thermocouple reading.
affect the thermocouple reading.
000899
Figure 20. Technique for Measuring T
PLATE
with 0° Angle Attachment
000900
Figure 21. Technique for Measuring T
PLATE
with 90° Angle Attachment