Intel III Xeon 900 MHz 80526KY9002M Data Sheet
Product codes
80526KY9002M
PENTIUM® III XEON™ PROCESSOR AT 600 MHz to 1 GHz with 256KB L2 Cache
THERMAL SPECIFICATIONS
56
between the thermal plate and heat sink. The other controllable factor (theta
θ heat sink to air) is determined
by the design of the heat sink and airflow around the heat sink. General Information on thermal interfaces and
heat sink design constraints can be found in AP-586, Pentium II Processor Thermal Design Guidelines (Order
Number 243331).
heat sink design constraints can be found in AP-586, Pentium II Processor Thermal Design Guidelines (Order
Number 243331).
6.2.2
THERMAL PLATE TO HEAT SINK INTERFACE MANAGEMENT GUIDE
Figure 19 shows suggested interface agent dispensing areas when using either Intel suggested interface
agent. Actual user area and interface agent selections will be determined by system issues in meeting the
TPLATE requirements.
agent. Actual user area and interface agent selections will be determined by system issues in meeting the
TPLATE requirements.
Figure 19. Interface Agent Dispensing Areas and Thermal Plate Temperature Measurement
Points
NOTES:
6.
Interface agent suggestions: ShinEtsu* G749 or Thermoset* TC330; Dispense volume adequate to ensure required
minimum area of coverage when cooling solution is attached. Areas A and B are suggested for processor core and
OCVR products. Recommended cooling solution mating surface flatness is no greater than 0.007” or flatter.
minimum area of coverage when cooling solution is attached. Areas A and B are suggested for processor core and
OCVR products. Recommended cooling solution mating surface flatness is no greater than 0.007” or flatter.
7.
Temperature of the entire thermal plate surface not to exceed 55
°
C for the Pentium® III Xeon™ processor at 600
MHz+ . Use any combination of interface agent, cooling solution, flatness condition, etc., to ensure this condition is met.
Thermocouple measurement locations are the expected high temperature locations without external heat source
influence. Ensure that external heat sources do not cause a violation of TPLATE requirements
Thermocouple measurement locations are the expected high temperature locations without external heat source
influence. Ensure that external heat sources do not cause a violation of TPLATE requirements