Intel 807 AV8062701079702 Data Sheet
Product codes
AV8062701079702
8.0
Package Specifications
Package Mechanical Attributes
The processors use a Flip Chip technology and Multi-Chip package (MCP) available in a
Ball Grid Array (BGA) package. The following table provides an overview of the
mechanical attributes of this package.
Table 52.
Package Mechanical Attributes
Parameter
Intel
®
Core
™
U-Processor
Intel
®
Pentium
®
Processor
Intel
®
Celeron
®
Processor
Intel
®
Core
™
M
Processor
Package
Technology
Package Type
Flip Chip Ball Grid Array
Flip Chip Ball Grid Array
Interconnect
Ball Grid Array (BGA)
Ball Grid Array (BGA)
Lead Free
Yes
Yes
Halogenated Flame
Retardant Free
Yes
Yes
Package
Configuration
Solder Ball Composition
SAC405
SAC405
Ball/Pin Count
1168
1234
Grid Array Pattern
Balls Anywhere
Balls Anywhere
Land Side Capacitors
Yes
Yes
Die Side Capacitors
No
No
Die Configuration
Multi-Chip Package (MCP) / 2 dies
Multi-Chip Package
(MCP) / 2 dies
Package
Dimension
Nominal Package Size
40 mm x 24 mm x
1.284 mm
1.284 mm
30 mm x 16.5 mm x
1.05 mm
Min Ball/Pin pitch
0.65 mm
0.5 mm
8.1
Processor—Package Specifications
5th Generation Intel
®
Core
™
Processor Family, Intel
®
Core
™
M Processor Family, Mobile Intel
®
Pentium
®
Processor Family, and
Mobile Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2
March 2015
96
Order No.: 330834-004v1