Intel 807 AV8062701079702 Data Sheet

U-Processor Line

67 N (15 lbf)

1, 2, 3

Intel

®

 Core

™

 M Processor Family

44 N (10 lbf)

1, 2, 3

Notes: 1. The thermal solution attach mechanism must not induce continuous stress to the package. It

may only apply a uniform load to the die to maintain a thermal interface.

2. This specification applies to the uniform compressive load in the direction perpendicular to the

dies’ top surface.

3. This specification is based on limited testing for design characterization.
4. Assumes a motherboard thickness of 1.0 mm or greater.
5. Assumes the use of a backing plate.

T

ABSOLUTE STORAGE

The non-operating device storage temperature.

Damage (latent or otherwise) may occur when

subjected to this temperature for any length of

time.

-25 °C

125 °C

1, 2, 3

T

SUSTAINED STORAGE

The ambient storage temperature limit (in

shipping media) for a sustained period of time.

-5 °C

40 °C

4, 5

RH

SUSTAINED STORAGE

The maximum device storage relative humidity for

a sustained period of time.

60% @ 24 °C

5, 6

TIME

SUSTAINED STORAGE

A prolonged or extended period of time: typically

associated with customer shelf life.

0

months

6

months

6

Notes: 1. Refers to a component device that is not assembled in a board or socket that is not to be

electrically connected to a voltage reference or I/O signals.

2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are

specified by applicable JEDEC standards.

3. T

ABSOLUTE STORAGE

 applies to the unassembled component only and does not apply to the shipping

media, moisture barrier bags or desiccant.

4. Intel-branded board products are certified to meet the following temperature and humidity limits

that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity

50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage

temperature limits are not specified for non-Intel branded boards.

5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all

moisture sensitive devices removed from the moisture barrier bag.

6. Nominal temperature and humidity conditions and durations are given and tested within the

constraints imposed by T

SUSTAINED STORAGE

 and customer shelf life in applicable Intel boxes and

bags.

5th Generation Intel

®

 Core

™

 Processor Family, Intel

®

 Core

™

 M Processor Family, Mobile Intel

®

 Pentium

®

 Processor Family, and

Mobile Intel

®

 Celeron

®

 Processor Family

March 2015

Datasheet – Volume 1 of 2

Order No.: 330834-004v1

97