Intel i3-2328M FF8062701275100 Data Sheet

Product codes
FF8062701275100
Page of 170
Datasheet, Volume 1
93
Electrical Specifications
Notes:
1.
 for signal description details.
2.
SA and SB refer to DDR3 Channel A and DDR3 Channel B.
3.
These signals only apply to BGA packages.
4.
The maximum rise/fall time of UNCOREPWRGOOD is 20 ns.
All Control Sideband Asynchronous signals are required to be asserted/de-asserted for 
at least 10 BCLKs with a maximum Trise/Tfall of 6 ns for the processor to recognize 
the proper signal state. See 
 for the DC specifications. 
7.7
Test Access Port (TAP) Connection
Due to the voltage levels supported by other components in the Test Access Port (TAP) 
logic, Intel recommends the processor be first in the TAP chain, followed by any other 
components within the system. A translation buffer should be used to connect to the 
rest of the chain unless one of the other components is capable of accepting an input of 
the appropriate voltage. Two copies of each signal may be required with each driving a 
different voltage level. 
The processor supports Boundary Scan (JTAG) IEEE 1149.1-2001 and IEEE 1149.6-
2003 standards. Some small portion of the I/O pins may support only one of these 
standards.
7.8
Storage Condition Specifications
Environmental storage condition limits define the temperature and relative humidity 
that the device is exposed to while being stored in a moisture barrier bag. The specified 
storage conditions are for component level prior to board attach.
 specifies absolute maximum and minimum storage temperature limits that 
represent the maximum or minimum device condition beyond which damage, latent or 
otherwise, may occur. The table also specifies sustained storage temperature, relative 
humidity, and time-duration limits. These limits specify the maximum or minimum 
device storage conditions for a sustained period of time. Failure to adhere to the 
following specifications can affect long term reliability of the processor.
Intel
®
 FDI
Single Ended
CMOS Input
FDI0_FSYNC, FDI1_FSYNC, FDI0_LSYNC, 
FDI1_LSYNC
Single Ended
Asynchronous CMOS 
Input
FDI_INT
Differential
FDI Output
FDI0_TX[3:0], FDI0_TX#[3:0], FDI1_TX[3:0], 
FDI1_TX#[3:0]
Future Compatibility
PROC_SELECT#, 
VCCSA_VID[0], 
VCCIO_SEL, 
SA_DIMM_VREFDQ, SB_DIMM_VREFDQ
Table 7-3.
Signal Groups
1
 (Sheet 3 of 3)
Signal Group
Type
Signals