Intel Core 2 Duo E7300 BX80570E7300 User Manual

Product codes
BX80570E7300
Page of 128
 
Introduction 
 
 
Thermal and Mechanical Design Guidelines   
 11 
Introduction 
1.1 
Document Goals and Scope 
1.1.1 
Importance of Thermal Management 
The objective of thermal management is to ensure that the temperatures of all 
components in a system are maintained within their functional temperature range. 
Within this temperature range, a component is expected to meet its specified 
performance. Operation outside the functional temperature range can degrade system 
performance, cause logic errors or cause component and/or system damage. 
Temperatures exceeding the maximum operating limit of a component may result in 
irreversible changes in the operating characteristics of this component. 
In a system environment, the processor temperature is a function of both system and 
component thermal characteristics. The system level thermal constraints consist of the 
local ambient air temperature and airflow over the processor as well as the physical 
constraints at and above the processor. The processor temperature depends in 
particular on the component power dissipation, the processor package thermal 
characteristics, and the processor thermal solution. 
All of these parameters are affected by the continued push of technology to increase 
processor performance levels and packaging density (more transistors). As operating 
frequencies increase and packaging size decreases, the power density increases while 
the thermal solution space and airflow typically become more constrained or remains 
the same within the system. The result is an increased importance on system design 
to ensure that thermal design requirements are met for each component, including 
the processor, in the system. 
1.1.2 
Document Goals 
Depending on the type of system and the chassis characteristics, new system and 
component designs may be required to provide adequate cooling for the processor. 
The goal of this document is to provide an understanding of these thermal 
characteristics and discuss guidelines for meeting the thermal requirements imposed 
on single processor systems using the Intel
®
 Core™2 Duo processor E8000, E7000 
series, Intel
®
 Pentium
®
 dual-core processor E6000, E5000 series, and Intel
®
 Celeron
®
 
processor E3x00 series. 
The concepts given in this document are applicable to any system form factor. Specific 
examples used will be the Intel enabled reference solution for ATX/uATX systems. See 
the applicable BTX form factor reference documents to design a thermal solution for 
that form factor.