Intel Core 2 Duo E7300 BX80570E7300 User Manual

Product codes
BX80570E7300
Page of 128
 
Introduction 
 
 
12  
 
Thermal and Mechanical Design Guidelines  
1.1.3 
Document Scope 
This design guide supports the following processors: 
 
Intel
®
 Core™2 Duo processor E8000 series with 6 MB cache applies to Intel
®
 
Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190 
 
Intel
®
 Core™2 Duo processor E7000 series with 3 MB cache applies to Intel
®
 
Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 
 
Intel
®
 Pentium
®
 dual-core processor E5000 series with 2 MB cache applies to 
Intel
®
 Pentium
®
 dual-core processors E5400, E5300, and E5200 
 
Intel
®
 Pentium
®
 dual-core processor E6000 series with 2 MB cache applies to 
Intel
®
 Pentium
®
 dual-core processor E6500 and E6300 
 
Intel
®
 Celeron
®
 processor E3x00 series with 1 MB cache applies to the Intel
®
 
Celeron
®
 processor E3300 and E3200 
In this document when a reference is made to “the processor” it is intended that this 
includes all the processors supported by this document. If needed for clarity, the 
specific processor will be listed. 
In this document, when a reference is made to the “the reference design” it is 
intended that this means ATX reference designs (E18764-001) supported by this 
document. If needed for clarify, the specific reference design will be listed. 
In this document, when a reference is made to “the datasheet”, the reader should 
refer to the Intel
®
 Core™2 Duo Processor E8000 and E7000 Series Datasheet,  Intel
®
 
Pentium
®
 Dual-Core Processor E6000 and E5000 Series Datasheet, and Intel
®
 
Celeron
®
 Processor E3x00 Series Datasheet. If needed for clarity the specific 
processor datasheet will be referenced. 
Chapter 
2 of this document discusses package thermal mechanical requirements to 
design a thermal solution for the processor in the context of personal computer 
applications.  
Chapter 
3 discusses the thermal solution considerations and metrology 
recommendations to validate a processor thermal solution.  
Chapter 
4 addresses the benefits of the processor’s integrated thermal management 
logic for thermal design.  
Chapter 
5 gives information on the Intel reference thermal solution for the processor 
in BTX platform.  
Chapter 
6 gives information on the Intel reference thermal solution for the processor 
in ATX platform.  
Chapter 
7 discusses the implementation of acoustic fan speed control. 
The physical dimensions and thermal specifications of the processor that are used in 
this document are for illustration only. Refer to the datasheet for the product 
dimensions, thermal power dissipation and maximum case temperature. In case of 
conflict, the data in the datasheet supersedes any data in this document.