Intel E3815 FH8065301567411 Data Sheet
Product codes
FH8065301567411
PCU – Serial Peripheral Interface (SPI)
Intel
®
Atom™ Processor E3800 Product Family
4378
Datasheet
31.2.9.1
Common Footprint Usage Model
To minimize platform motherboard redesign and to enable platform Bill of Material
(BOM) selectability, many OEMs design their motherboard with a single common
footprint. This common footprint allows the population of a soldered down device or a
socket that accepts a leadless device. This enables the board manufacturer to support,
using selection of the appropriate BOM, either of these solutions on the same system
without requiring any board redesign.
(BOM) selectability, many OEMs design their motherboard with a single common
footprint. This common footprint allows the population of a soldered down device or a
socket that accepts a leadless device. This enables the board manufacturer to support,
using selection of the appropriate BOM, either of these solutions on the same system
without requiring any board redesign.
The common footprint usage model is desirable during system debug and by Flash
content developers since the leadless device can be easily removed and reprogrammed
without damage to device leads. When the board and Flash content is mature for high-
volume production, both the socketed leadless solution and the soldered down leaded
solution are available through BOM selection.
content developers since the leadless device can be easily removed and reprogrammed
without damage to device leads. When the board and Flash content is mature for high-
volume production, both the socketed leadless solution and the soldered down leaded
solution are available through BOM selection.
31.2.9.2
Serial Flash Device Package Recommendations
It is highly recommended that the common footprint usage model be supported. An
example of how this can be accomplished is as follows:
example of how this can be accomplished is as follows:
•
The recommended pinout for 8-pin serial Flash devices is used (refer to
).
•
The 8-pin device is supported in either an 8-contact VDFPN (6x5 mm MLP) package
or an 8-contact WSON (5x6 mm) package. These packages can fit into a socket
that is land pattern compatible with the wide body SO8 package.
or an 8-contact WSON (5x6 mm) package. These packages can fit into a socket
that is land pattern compatible with the wide body SO8 package.
•
The 8-pin device is supported in the SO8 (150 mil) and in the wide-body SO8 (200
mil) packages.
mil) packages.
•
The 16-pin device is supported in the SO16 (300 mil) package.
31.3
Use
31.3.1
Hardware vs. Software Sequencing
Hardware and Software sequencing are the two methods the SoC uses to communicate
with the Flash via programming registers for each of the three masters.
with the Flash via programming registers for each of the three masters.
31.3.1.1
Hardware Sequencing
Hardware sequencing has a predefined list of opcodes, see
for more details,
with only the erase opcode being programmable. This mode is only available if the
descriptor is present and valid. Security Engine firmware must use HW sequencing, so
descriptor is present and valid. Security Engine firmware must use HW sequencing, so
6
No Connect
14
No Connect
7
Chip Select
15
Serial Data In
8
Serial Data Out
16
Serial Clock
Table 302. Recommended Pinout for 16-Pin Serial Flash Device
Pin #
Signal
Pin #
Signal