Intel Xeon X3440 BX80605X3440 User Manual
Product codes
BX80605X3440
Thermal/Mechanical Specifications and Design Guidelines
13
Package Mechanical and Storage Specifications
2
Package Mechanical and
Storage Specifications
2.1
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard via the LGA1156 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink.
the motherboard via the LGA1156 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink.
shows a sketch of the processor package
components and how they are assembled together. Refer to
for complete details on the LGA1156 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1.
Socket and motherboard are included for reference and are not part of processor package.
2.
For clarity the ILM is not shown.
Figure 2-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
Core (die)
TIM
LGA1156 Socket