Intel Xeon X3440 BX80605X3440 User Manual
Product codes
BX80605X3440
Thermal/Mechanical Specifications and Design Guidelines
15
Package Mechanical and Storage Specifications
2.1.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution.
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution.
.
Notes:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the maximum static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.
3.
These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4.
Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum
thermal solution.
2.1.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
Notes:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4.
These guidelines are based on limited testing for design characterization.
2.1.5
Package Insertion Specifications
The processor can be inserted into and removed from an LGA1156 socket 15 times. The
socket should meet the LGA1156 socket requirements detailed in
socket should meet the LGA1156 socket requirements detailed in
2.1.6
Processor Mass Specification
The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all
the components that are included in the package.
the components that are included in the package.
Table 2-1.
Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
Static Compressive Load
—
600 N [135 lbf]
Dynamic Compressive
Load
—
712 N [160 lbf]
Table 2-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
311 N [70 lbf]
Tensile
111 N [25 lbf]
Torque
3.95 N-m [35 lbf-in]