Intel Xeon X3440 BX80605X3440 User Manual

14

Thermal/Mechanical Specifications and Design Guidelines

 shows the basic package layout and dimensions. The detailed package 

mechanical drawings are in 

. The drawings include dimensions necessary to 

design a thermal solution for the processor. These dimensions include:

1. Package reference dimensions with tolerances (total height, length, width, and so 

forth.)

2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.

The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into 
the required keep-out zones. Decoupling capacitors are typically mounted to either the 
topside or land-side of the package substrate. See 

 for keep-

out zones. The location and quantity of package capacitors may change due to 
manufacturing efficiencies but will remain within the component keep-in. This keep-in 
zone includes solder paste and is a post reflow maximum height for the components.

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