Intel Xeon X3440 BX80605X3440 User Manual
Product codes
BX80605X3440
Sensor Based Thermal Specification Design Guidance
54
Thermal/Mechanical Specifications and Design Guidelines
7.2
Sensor Based Thermal Specification
The sensor based thermal specification consists of two parts. The first is a thermal
profile that defines the maximum TTV T
profile that defines the maximum TTV T
CASE
as a function of TTV power dissipation. The
thermal profile defines the boundary conditions for validation of the thermal solution.
The second part is a defined thermal solution performance (Ψ
CA
) as a function of the
DTS value as reported over the PECI bus when DTS is greater than T
CONTROL
. This
defines the operational limits for the processor using the TTV validated thermal
solution.
solution.
Figure 7-1. Comparison of Case Temperature versus Sensor Based Specification
Power
Sensor Based Specification (DTS Temp)
TDP
Tcontrol
Ta = 30 C
Ψ-ca = 0.564
Ψ-ca = 0.448
Power
Current Specification (Case Temp)
TDP
Tcontrol
Ta = 45.1 °C
Ta = 30 °C
Ψ-ca = 0.292
Ψ-ca = 0.292
Power
Sensor Based Specification (DTS Temp)
TDP
Tcontrol
Ta = 30 C
Ψ-ca = 0.564
Ψ-ca = 0.448
Power
Current Specification (Case Temp)
TDP
Tcontrol
Ta = 45.1 °C
Ta = 30 °C
Ψ-ca = 0.292
Ψ-ca = 0.292