Intel Xeon X3440 BX80605X3440 User Manual
Product codes
BX80605X3440
Thermal/Mechanical Specifications and Design Guidelines
55
Sensor Based Thermal Specification Design Guidance
7.2.1
TTV Thermal Profile
For the sensor-based specification the only reference made to a case temperature
measurement is on the TTV. Functional thermal validation will not require the user to
apply a thermocouple to the processor package or measure processor power.
measurement is on the TTV. Functional thermal validation will not require the user to
apply a thermocouple to the processor package or measure processor power.
Note:
All functional compliance testing will be based on fan speed response to the reported
DTS values above T
CONTROL
. As a result no conversion of TTV T
CASE
to processor T
CASE
will be necessary.
A knowledge of the system boundary conditions is necessary to perform the heatsink
validation.
validation.
will provide more detail on defining the boundary conditions.
The TTV is placed in the socket and powered to the recommended value to simulate the
TDP condition. See
TDP condition. See
for an example of the Intel
®
Xeon
®
processor 3400
series (95W) TTV thermal profile.
Note:
This graph is provided as a reference, the complete thermal specification is in
.
7.2.2
Specification When DTS value is Greater than T
CONTROL
The product specification provides a table of Ψ
CA
values at DTS = T
CONTROL
and
DTS = -1 as a function of T
AMBIENT
(inlet to heatsink). Between these two defined
points, a linear interpolation can be done for any DTS value reported by the processor.
The fan speed control algorithm has enough information using only the DTS value and
T
T
AMBIENT
to command the thermal solution to provide just enough cooling to keep the
part on the thermal profile.
Figure 7-2. Intel
®
Xeon
®
Processor 3400 Series (95W) Thermal Profile
TTV Thermal Profile
Y = Power x 0.29 + 45.1
40.0
45.0
50.0
55.0
60.0
65.0
70.0
75.0
0
20
40
60
80
100
TTV Power (W)
T
T
V
C
a
se T
e
m
p
er
at
u
re
(
°C
)