Intel Xeon X3440 BX80605X3440 User Manual
Product codes
BX80605X3440
Sensor Based Thermal Specification Design Guidance
56
Thermal/Mechanical Specifications and Design Guidelines
In the prior thermal specifications this region, DTS values greater than T
CONTROL
, was
defined by the processor thermal profile. This required the user to estimate the
processor power and case temperature. Neither of these two data points are accessible
in real time for the fan speed control system. As a result the designer had to assume
the worst case T
processor power and case temperature. Neither of these two data points are accessible
in real time for the fan speed control system. As a result the designer had to assume
the worst case T
AMBIENT
and drive the fans to accommodate that boundary condition.
7.3
Thermal Solution Design Process
Thermal solution design guidance for this specification is the same as with previous
products. The initial design needs to take into account the target market and overall
product requirements for the system. This can be broken down into several steps:
products. The initial design needs to take into account the target market and overall
product requirements for the system. This can be broken down into several steps:
• Boundary condition definition
• Thermal design / modelling
• Thermal t
• Thermal design / modelling
• Thermal t
esting