Cypress CY8C20396 Manual De Usuario
CY8C20x36/46/66, CY8C20396
Document Number: 001-12696 Rev. *D
Page 26 of 34
Packaging Information
This section illustrates the packaging specifications for the CY8C20x36/46/66, CY8C20396 PSoC device, along with the thermal
impedances for each package.
impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161
.
Figure 14. 16-Pin Chip On Lead 3x3 mm (Sawn)
Figure 15. 24-Pin (4x4 x 0.6 mm) QFN
001-09116 *D
001-13937 *B