Avnet Inc AVTEG001 Manuel D’Utilisation
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
12 Shipping, Handling and Storage
12.1 Shipping
Bulk orders of the Avnet BCM4343W SoC module are delivered in reels of 600.
(See Section 7.6 for detail)
(See Section 7.6 for detail)
12.2 Handling
The AES-BCM4343W-M1-G module contains sensitive electronic circuitry that require proper ESD
protection when handling. Failure to follow these ESD procedures may result in permanent damage to
the module.
The module should not be subjected to excessive mechanical shock.
protection when handling. Failure to follow these ESD procedures may result in permanent damage to
the module.
The module should not be subjected to excessive mechanical shock.
12.3 Moisture Sensitivity (MSL)
Modules that have been exposed to moisture and environmental conditions exceeding the prescribed
packaging and storage conditions detailed in J-STD-020 (eg. not continuously in a sealed bag with a
desiccant pack) MUST be baked before mounting! (Failure to meet the packaging and storage
conditions described, will result in irreparable damage to modules during solder reflow soldering).
For devices that are packaged in a Moisture Barrier Bag with a desiccant pack and HIC (Humidity
Indicator Card), the HIC card should be referenced and J-STD-033 consulted to determine if baking is
required prior to reflow soldering.
In cases where baking is required, refer to J-STD-033 for details of the bake procedure.
“Broken reel” module quantities (under 600 units) typically require baking before reflow soldering
packaging and storage conditions detailed in J-STD-020 (eg. not continuously in a sealed bag with a
desiccant pack) MUST be baked before mounting! (Failure to meet the packaging and storage
conditions described, will result in irreparable damage to modules during solder reflow soldering).
For devices that are packaged in a Moisture Barrier Bag with a desiccant pack and HIC (Humidity
Indicator Card), the HIC card should be referenced and J-STD-033 consulted to determine if baking is
required prior to reflow soldering.
In cases where baking is required, refer to J-STD-033 for details of the bake procedure.
“Broken reel” module quantities (under 600 units) typically require baking before reflow soldering
12.4 Storage
Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40ºC and <90%
room humidity (RH).
Do not store in salty air or an environment where there is a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
room humidity (RH).
Do not store in salty air or an environment where there is a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.