Freescale Semiconductor MPC830x PowerQUICC II Pro Processor Evaluation Kit MPC8309-KIT MPC8309-KIT Fiche De Données

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MPC8309-KIT
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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
14
Freescale Semiconductor
 
DDR2 SDRAM
The following table provides the PLL lock times.
5.1
Reset signals DC electrical characteristics
The following table provides the DC electrical characteristics for the MPC8309 reset signals mentioned in 
.
6
DDR2 SDRAM
This section describes the DC and AC electrical specifications for the DDR2 SDRAM interface of the 
MPC8309. Note that DDR2 SDRAM is GV
DD
(typ) = 1.8 V.
6.1
DDR2 SDRAM DC electrical characteristics
The following table provides the recommended operating conditions for the DDR2 SDRAM component(s) 
of the MPC8309 when GV
DD
(typ) = 1.8 V
.
The following table provides the DDR2 capacitance when GV
DD
(typ) = 1.8 V.
Input setup time for POR configuration signals 
(CFG_RESET_SOURCE[0:3]) with respect to negation of PORESET
4
t
SYS_CLK_IN
1, 2
Input hold time for POR config signals with respect to negation of 
HRESET 
0
ns
1, 
2
Notes:
1.  t
SYS_CLK_IN
 is the clock period of the input clock applied to SYS_CLK_IN. For more details, see the MPC8309
 PowerQUICC 
II Pro Integrated Communications Processor Family Reference Manual.
2.  POR configuration signals consist of CFG_RESET_SOURCE[0:3].
Table 10. PLL lock times
Parameter/Condition
Min
Max
Unit
Note
PLL lock times
100
μs
Table 11. Reset signals DC electrical characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Note
Output high voltage
V
OH
I
OH
= –6.0 mA 
2.4
V
1
Output low voltage
V
OL
 I
OL
= 6.0 mA
0.5
V
1
Output low voltage
V
OL
I
OL
= 3.2 mA
0.4
V
1
Input high voltage
V
IH
2.0
OV
DD
+ 0.3
V
1
Input low voltage
V
IL
–0.3
0.8
V
Input current 
I
IN
0 V
≤ V
IN
 
≤ OV
DD
— ±
5
μA
Note:
 
1. This specification applies when operating from 3.3 V supply. 
Table 9. RESET initialization timing specifications (continued)