Lenovo Intel Xeon E5520 67Y0011 Manuale Utente

18

Thermal/Mechanical Design Guide

As indicated in 

, access is provided to facilitate manual installation and 

removal of the package. 

To assist in package orientation and alignment with the socket:

• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for 

proper orientation.

• The package substrate has orientation notches along two opposing edges of the 

package, offset from the centerline. The socket has two corresponding orientation 
posts to physically prevent mis-orientation of the package. These orientation 
features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the 

package.

See 

 for information regarding a tool designed to provide mechanical 

assistance during processor installation and removal.

.

Standoffs on the bottom of the socket base establish the minimum socket height after 
solder reflow and are specified in 

Similarly, a seating plane on the topside of the socket establishes the minimum 
package height. See 

 for the calculated IHS height above the motherboard.

alignment 

walls

orientation 

notch

orientation 

post

access

Pin1 triangle

Pin1 chamfer

alignment 

walls

orientation 

notch

orientation 

post

access

Pin1 triangle

Pin1 chamfer