Lenovo Intel Xeon E5520 67Y0011 Manuale Utente

Thermal/Mechanical Design Guide

19

The socket must withstand 30 cycles of processor insertion and removal. The max 
chain contact resistance from 

 must be met when mated in the 1st and 30th 

cycles. 

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

There are three markings on the socket: 

• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).

All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) 
without degrading, and must be visible after the socket is mounted on the 
motherboard. 

LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table 
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force 
to insert the package into the socket. 

Socket information needed for motherboard design is given in 

. 

This information should be used in conjunction with the reference motherboard keep-
out drawings provided in 

 to ensure compatibility with the reference thermal 

mechanical components.