STMicroelectronics M24C64-WBN6P Memory IC M24C64-WBN6P Scheda Tecnica



DocID16891 Rev 28

 

1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to V

SS

. It must not be 

connected to any other voltage or signal line on the PCB, for example during the soldering process.

          

1. Values in inches are converted from mm and rounded to four decimal digits.

A

0.550

0.450

0.600

0.0217

0.0177

0.0236

A1

0.020

0.000

0.050

0.0008

0.0000

0.0020

b

0.250

0.200

0.300

0.0098

0.0079

0.0118

D

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

E

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

e

0.500

–

–

0.0197

–

–

K (rev MC)

–

0.300

–

–

0.0118

–

L

–

0.300

0.500

–

0.0118

0.0197

L1

–

–

0.150

–

–

0.0059

L3

–

0.300

–

–

0.0118

–

eee

(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from 

measuring.

–

0.080

–

–

0.0031

–

D

E

ZW_MEeV2

A

A1

eee

L1

e

b

D2

L

E2

L3

Pin 1

K

MC