STMicroelectronics M24C64-WBN6P Memory IC M24C64-WBN6P Scheda Tecnica
Codici prodotto
M24C64-WBN6P
Package mechanical data
M24C64-W M24C64-R M24C64-F
DocID16891 Rev 28
Figure 21. Thin WLCSP 8-bump wafer-length chip-scale package outline
(M24C64-DFCT6TP/K)
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 23. Thin WLCSP 8-bump wafer-length chip-scale package mechanical data
(M24C64-DFCT6TP/K)
Symbol
millimeters
inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ
Min
Max
Typ
Min
Max
A
0.315
0.300
0.330
0.0124
0.0118
0.0130
A1
0.115
0.0045
A2
0.200
0.0079
b
(2)
2. Dimension measured at the maximum bump diameter parallel to primary datum Z.
0.160
0.0063
D
1.073
1.093
0.0422
0.0430
E
0.959
0.979
0.0378
0.0385
e
0.693
0.0273
e1
0.800
0.0315
e2
0.400
0.0157
F
0.133
0.0052
G
0.137
0.00524
aaa
0.110
0.0043
eee
0.060
0.0043
(4X)
aaa
Wafer back side
D
E
Side view
Detail A
A2
A
e
e2
e1
G
F
Bumps side
F
Detail A
Rotated 90 °
Bump
eee
Seating plane
1Ci_ME_V2
e2
b
X
Y
Z
Z
Reference
Orientation
reference
reference
H
A1