Manuali utente per ZTE Corporation ZTEMC2261

Sommario

• 1. Mechanical Interface

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• 1.1. Physical Features

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• 1.2. Mechanical size

  11
• 2. Electrical Interface

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• 2.1. Pin Assignments

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• 2.2. Digital logic characteristics

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• 3.1. Power Management

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• 3.2. GPIO

  17
• 3.3. USB

  17
• 3.4. UART

  18
• 3.5. Powering the Module Using the MDB

  19
• 4. Antenna Interface

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• 4.1. Antenna Installation

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• 4.2. Antenna Pad

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• 4.3. Antenna connector

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• 5. RF Interface

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• 5.1. Overview

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• 5.2. Antenna Subsystem

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• 5.2.1. Antenna Specifications

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• 5.2.2. Cable Loss

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• 5.2.3. Antenna Gain Minimum Requirements

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• 5.2.4. Antenna Gain Maximum Requirements

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• 5.2.5. Antenna Matching

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• 5.2.6. PCB Design Considerations

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• 5.2.7. Other Precautions

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• 5.2.8. Grounding

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• 6. Test Capabilities

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• 6.1. Test Description

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• 6.2. CDMA Test Equipment and Tools

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• 6.3. RF Performance Requirements

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• 6.3.1. CDMA2000 1X RF Rx Specification

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• 6.3.2. CDMA2000 1X RF Tx Specification:

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• 6.4. Environmental Reliability Requirement

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• 6.4.1. High Temperature Operation Test

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• 6.4.2. Low Temperature Operation Test

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• 6.4.3. High Temperature Storage Test

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• 6.4.4. Low Temperature Storage Test

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• 6.4.5. High Temperature High Humidity Operation Test

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• 6.4.6. Temperature Concussion Test

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• 6.5. Electro Magnetic Compatibility

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• 6.5.1. ESD Immunity Test

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• 6.5.2. Radiated Emissions Test

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• Major Technical Parameters

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• MC2261 Module 68-pin Electrical Interface

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• Baseband digital I/O characteristics for VDD_PX = 1.8 V nominal

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• Baseband digital I/O characteristics for VDD_PX = 2.85 V nominal

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• Input Power Characteristics

  17
• Return Loss in the Active Band

  21
• Product specifications of NMM22-5017 connector

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• Product specifications of SSMB-50TKE-10 connector

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• The requirement of dual band antenna

  25
• CDMA2000 1X RF Rx Specification

  30
• CDMA2000 1X RF Tx Specification

  30
• High Temperature Operation Test

  31
• Low Temperature Operation Test

  31
• High Temperature Storage Test

  32
• Low Temperature Storage Test

  32
• High Temperature High Humidity Operation Test

  32
• Temperature Concussion Test

  32
• ESD Immunity Test

  33
• Radiated Emissions Test

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• MC2261 TOP SIDE

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• Figure 1–2: MC2261 BOTTOM SIDE

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• MC2261 Module Illustration

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• Powered by VBAT and VPH_PWR pin

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• USB Typical Circuit

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• Wire serial level conversion circuit

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• wire serial level conversion circuit

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• wire serial level conversion circuit

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• Module Development Board Illustration

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• First method to connect the module to RF test equipment

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• Second method to connect the module to RF test equipment

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• Specification of NMM22-5017 connector

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• Specification of SSMB-50TKE-10

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• CDMA Connector

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• CDMA Connector on daughter board

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• Antenna Matching Circuit

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• CDMA Connector

  27
• Module Development Board Illustration

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• First method to connect the module to RF test equipment

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• Second method to connect the module to RF test equipment

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• First method to connect the module to RF antenna

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• Second method to connect the module to RF antenna

  29