Intel R2000BB4GS9 データシート
Intel
®
Server System R2000BB Product Family TPS
24
Revision 2.0
4. Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between 10ºC- 35ºC
with limited excursion based operation up to 45ºC, as specified in Table 2. System Environmental Limits
Summary. Working with integrated platform management, several features within the system are designed to
move air in a front to back direction, through the system and over critical components to prevent them from
overheating and allow the system to operate with best performance.
with limited excursion based operation up to 45ºC, as specified in Table 2. System Environmental Limits
Summary. Working with integrated platform management, several features within the system are designed to
move air in a front to back direction, through the system and over critical components to prevent them from
overheating and allow the system to operate with best performance.
The Intel
®
Server System R2000BB product family supports short-term, excursion-based, operation up to 45°C
(ASHRAE A4) with limited performance impact. The configuration requirements and limitations are described
in the configuration matrix found in Appendix D of this document and in the Intel
in the configuration matrix found in Appendix D of this document and in the Intel
®
S2400B Product Family
Power Budget and Thermal Configuration Tool, available as a download online at http://www.intel.com/support.
The installation and functionality of several system components are used to maintain system thermals. They
include five managed 60mm system fans, one integrated 40mm fan for each installed power supply module, an
air duct, populated hard drive carriers, and installed CPU heats sinks. Hard drive carriers can be populated
with a hard drive or supplied drive blank. In addition, it may be necessary to have specific DIMM slots
populated with DIMMs or factory installed DIMM blanks.
include five managed 60mm system fans, one integrated 40mm fan for each installed power supply module, an
air duct, populated hard drive carriers, and installed CPU heats sinks. Hard drive carriers can be populated
with a hard drive or supplied drive blank. In addition, it may be necessary to have specific DIMM slots
populated with DIMMs or factory installed DIMM blanks.
4.1 Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet the following
operating and configuration guidelines:
operating and configuration guidelines:
• The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE Class A2) with
short term excursion based operation up to 45ºC (ASHRAE Class A4).
o
The system can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours per year
o
The system can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours per year
o
System performance may be impacted when operating within the extended operating
temperature range
o
There is no long term system reliability impact when operating at the extended temperature
range within the approved limits.
• Specific configuration requirements and limitations are documented in Appendix D of this document
and in the configuration matrix found in the Intel
®
S2400BB Product Family Power Budget and Thermal
Configuration Tool, available as a download online at http://www.intel.com/support..
• The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must be installed
at all times, with or without a processor installed.
• Memory Slot population requirements –
NOTE: Some system configurations may come with factory installed DIMM blanks. DIMM blanks
should only be removed when installing a DIMM in the same DIMM slot. Memory population rules apply
when installing DIMMs.
should only be removed when installing a DIMM in the same DIMM slot. Memory population rules apply
when installing DIMMs.
o
DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, and C. Start
with1st DIMM (Blue Slot) on each channel, then slot 2. Only remove factory installed DIMM
blanks when populating the slot with memory.
blanks when populating the slot with memory.
o
DIMM Population Rules on CPU-2 – Install DIMMs in order; Channels D, E, and F. Start
with1st DIMM (Blue Slot) on each channel, then slot 2. Only remove factory installed DIMM
blanks when populating the slot with memory.
blanks when populating the slot with memory.
• All hard drive bays must be populated. Hard drive carriers can be populated with a hard drive or
supplied drive blank.
• With the system operating, the air duct must be installed at all times
• In single power supply configurations, the 2
nd
power supply bay must have the supplied filler blank
installed at all times.
• Two power supplies must be installed for the system to support fan redundancy.
• Thermally, the system can support the following PCI add-in cards.
o
Add-in cards with a minimum 100 LFM (0.5 m/s) air flow requirement can be installed in any
available add-in card slot in both Riser Card #1 and Riser Card #2