Intel R2000BB4GS9 データシート
Intel
®
Server System R2000BB Product Family TPS
Revision 2.0
25
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Add-in cards with a minimum 200 LFM (1 m/s) air flow requirement can be installed in any
available add-in card slot on Riser Card #1 and the bottom add-in card slot on Riser Card #2.
Middle and Top add-in card slots on Riser Card #2 cannot support PCI add-in cards with air flow
requirements greater than 100 LFM.
Middle and Top add-in card slots on Riser Card #2 cannot support PCI add-in cards with air flow
requirements greater than 100 LFM.
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Add-in cards with a >200 LFM air flow requirement cannot be supported.
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Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM (0.5m/s). Some
high power add-in cards have minimum air flow requirements of 200 LFM (1 m/s). System
integrators should verify PCI add-in card air flow requirements from vendor specifications when
integrating add-in cards into the system.
integrators should verify PCI add-in card air flow requirements from vendor specifications when
integrating add-in cards into the system.
• The system top-cover must be installed at all times when the system is in operation. The only exception
to this requirement is to hot replace a failed system fan, in which case the top cover can be removed for
no more than 3 minutes at a time.
no more than 3 minutes at a time.
4.2 Thermal Management Overview
In order to maintain the necessary airflow within the system, all of the previously listed components and top
cover need to be properly installed.
cover need to be properly installed.
For best system performance, the external ambient temperature should
remain below 35ºC and all system fans should be operational. The system is designed for fan redundancy
when the system is configured with two power supplies. Should a single system fan fail (System fan or Power
Supply Fan), integrated platform management will: change the state of the System Status LED to flashing
Green, report an error to the system event log, and automatically adjust fan speeds as needed to maintain
system temperatures below maximum thermal limits.
Note: All system fans are controlled independent of each other. The fan control system may adjust fan speeds
for different fans based on increasing/decreasing temperatures in different thermal zones within the chassis.
In the event that system temperatures should continue to increase with the system fans operating at their
maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or
the processors or both, in order to keep components from overheating and keep the system operational.
Throttling of these sub-systems will continue until system temperatures are reduced below preprogrammed
limits.
Should system temperatures increase to a point beyond the maximum thermal limits, the system will shut
down, the System Status LED will change to a solid Amber state, and the event will be logged to the system
event log.
when the system is configured with two power supplies. Should a single system fan fail (System fan or Power
Supply Fan), integrated platform management will: change the state of the System Status LED to flashing
Green, report an error to the system event log, and automatically adjust fan speeds as needed to maintain
system temperatures below maximum thermal limits.
Note: All system fans are controlled independent of each other. The fan control system may adjust fan speeds
for different fans based on increasing/decreasing temperatures in different thermal zones within the chassis.
In the event that system temperatures should continue to increase with the system fans operating at their
maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or
the processors or both, in order to keep components from overheating and keep the system operational.
Throttling of these sub-systems will continue until system temperatures are reduced below preprogrammed
limits.
Should system temperatures increase to a point beyond the maximum thermal limits, the system will shut
down, the System Status LED will change to a solid Amber state, and the event will be logged to the system
event log.
Note: Sensor data records (SDRs) for any given system configuration must be loaded by the system integrator
for proper thermal management of the system. SDRs are loaded using the FRUSDR utility.
for proper thermal management of the system. SDRs are loaded using the FRUSDR utility.
An intelligent Fan Speed Control (FSC) and thermal management technology (mechanism) is used to maintain
comprehensive thermal protection, deliver the best system acoustics, and fan power efficiency. Options in <F2>
BIOS Setup (BIOS>Advanced>System Acoustic and Performance Configuration) allow for parameter
adjustments based on the actual system configuration and usage. Refer to the following sections for a
description of each setting.
comprehensive thermal protection, deliver the best system acoustics, and fan power efficiency. Options in <F2>
BIOS Setup (BIOS>Advanced>System Acoustic and Performance Configuration) allow for parameter
adjustments based on the actual system configuration and usage. Refer to the following sections for a
description of each setting.
4.2.1
Set Throttling Mode
This option is used to select the desired memory thermal throttling mechanism. Available settings include:
[Auto], [DCLTT], [SCLTT] and [SOLTT].
[Auto] – Factory Default Setting - BIOS automatically detects and identifies the appropriate thermal throttling
mechanism based on DIMM type, airflow input, and DIMM sensor availability.
[DCLTT] – Dynamic Closed Loop Thermal Throttling: for the SOD DIMM with system airflow input
[SCLTT] – Static Close Loop Thermal Throttling: for the SOD DIMM without system airflow input
[SOLTT] – Static Open Loop Thermal Throttling: for the DIMMs without sensor on dimm (SOD)
[Auto], [DCLTT], [SCLTT] and [SOLTT].
[Auto] – Factory Default Setting - BIOS automatically detects and identifies the appropriate thermal throttling
mechanism based on DIMM type, airflow input, and DIMM sensor availability.
[DCLTT] – Dynamic Closed Loop Thermal Throttling: for the SOD DIMM with system airflow input
[SCLTT] – Static Close Loop Thermal Throttling: for the SOD DIMM without system airflow input
[SOLTT] – Static Open Loop Thermal Throttling: for the DIMMs without sensor on dimm (SOD)