Texas Instruments DLP Flex Cables DLP5500FLEX DLP5500FLEX 데이터 시트
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DLP5500FLEX
DLPS013E – APRIL 2010 – REVISED SEPTEMBER 2013
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted). Stresses beyond those listed under "
” may cause permanent damage to the device. The
are stress ratings only, and functional
performance of the device at these or any other conditions beyond those indicated under “
” is not implied. Exposure to Absolute Maximum Rated conditions for extended periods may affect device reliability.
PARAMETER
CONDITIONS
MIN
Nom
MAX
UNIT
Electrical
V
CC
Voltage applied to V
CC
(1) (2)
–0.5
4
V
V
CCI
Voltage applied to V
CCI
(1) (2)
–0.5
4
V
Maximum differential voltage,
|V
ID
|
Damage can occur to internal
700
mV
resistor if exceeded, See
Delta supply voltage |V
CC
– V
CCI
|
.3
V
V
CC2
Voltage applied to V
OFFSET
(1) (2) (3)
–0.5
9
V
Voltage applied to MBRST[0:15]
V
MBRST
-28
28
V
Input Pins
Voltage applied to all other input
–0.5
V
CC
+ 0.3
V
terminals
(1)
Current required from a high-level
V
OH
= 2.4 V
–20
mA
output
Current required from a low-level
V
OL
= 0.4 V
15
mA
output
Environmental
Storage temperature range
(4) (5)
-40
80
°C
Storage humidity
(4) (5)
Non-Condensing
0
95
% RH
< 420 nm
(7)
2
Illumination power density
(4) (6)
420 to 700
(8)
mW/cm
2
> 700 nm
10
Electrostatic discharge immunity
2000
for LVCMOS pins
(9)
V
Electrostatic discharge immunity
250
for MBRST[0:15] pins
(1)
All voltages referenced to V
SS
(ground).
(2)
Voltages V
CC
, V
CCI
, and V
CC2
are required for proper DMD operation.
(3)
Exceeding the recommended allowable absolute voltage difference between V
CC
and V
CCI
may result in excess current draw. The
difference between V
CC
and V
CCI
, | V
CC
- V
CCI
|, should be less than .3V.
(4)
Optimal, long-term performance of the Digital Micromirror Device (DMD) can be affected by various application parameters, including
illumination spectrum, illumination power density, micromirror landed duty cycle, ambient temperature (both storage and operating), case
temperature, ambient humidity (both storage and operating), and power on or off duty cycle. TI recommends that application-specific
effects be considered as early as possible in the design cycle. Contact your local Texas Instruments representative for additional
information related to optimizing the DMD performance.
illumination spectrum, illumination power density, micromirror landed duty cycle, ambient temperature (both storage and operating), case
temperature, ambient humidity (both storage and operating), and power on or off duty cycle. TI recommends that application-specific
effects be considered as early as possible in the design cycle. Contact your local Texas Instruments representative for additional
information related to optimizing the DMD performance.
(5)
Simultaneous exposure to high storage temperature and high storage humidity may affect device reliability.
(6)
Total integrated illumination power density, above or below the indicated wavelength threshold.
(7)
The maximum operating conditions for operating temperature and illumination power density for wavelengths < 420 nm shall not be
implemented simultaneously.
implemented simultaneously.
(8)
Limited only by the resulting micromirror array temperature .See the
for information related to calculating the
micromirror array temperature.
(9)
Tested in accordance with JESD22-A114-B Electrostatic Discharge (ESD) sensitivity testing Human Body Model (HBM).
Copyright © 2010–2013, Texas Instruments Incorporated
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