Intel D2500 사용자 매뉴얼

차례

• Intel® Atom™ Processor D2000 and N2000 Series

  1
• Revision History

  7
• 1 Introduction

  9
  • 1.1 Intel® Atom™ Processor D2000 Series and N2000 Series Features

    9
  • 1.2 System Memory Features

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  • 1.3 Direct Media Interface Features

    11
  • 1.4 Graphics Processing Unit Features

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  • 1.5 Video

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  • 1.6 Clocking

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  • 1.7 Power Management

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    • 1.7.1 Terminology

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  • 1.8 References

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  • 1.9 System Block Diagram

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    • 1.9.1 PHOLD limitation on Legacy Feature

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• 2 Signal Description

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  • 2.1 CPU Legacy Signal

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  • 2.2 System Memory Interface

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  • 2.3 DMI - Direct Media Interface

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  • 2.4 PLL Signals

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  • 2.5 Analog Display Signals

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  • 2.6 LVDS Signals

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  • 2.7 DDI Audio Interface

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  • 2.8 DDI Port 0

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  • 2.9 DDI Port1

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  • 2.10 JTAG/ITP Signals

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  • 2.11 Error and Thermal Protection

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  • 2.12 Processor Core Power Signals

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  • 2.13 Graphics, DMI and Memory Core Power Signals

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  • 2.14 Ground

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• 3 Functional Description

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  • 3.1 System Memory Controller

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    • 3.1.1 System Memory Organization Modes

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    • 3.1.2 System Memory Technology Supported

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    • 3.1.3 Rules for populating DIMM Slots

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  • 3.2 Graphics Processing Unit

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    • 3.2.1 3-D Core Key Features

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    • 3.2.2 2D Engine

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    • 3.2.3 Analog Display Port Characteristics

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    • 3.2.4 Digital Display Interfaces

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    • 3.2.5 Multiple Display Configurations

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  • 3.3 Thermal Sensor

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    • 3.3.1 PCI Device 0, Function 0

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  • 3.4 Power Management

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    • 3.4.1 Interface Power States Supported

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    • 3.4.2 Intel® Hyper-Threading Technology

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• 4 Electrical Specifications

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  • 4.1 Power and Ground Balls

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  • 4.2 Decoupling Guidelines

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    • 4.2.1 Voltage Rail Decoupling

      48
  • 4.3 Processor Clocking

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    • 4.3.1 PLL Power Supply

      49
  • 4.4 Voltage Identification (VID)

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  • 4.5 Catastrophic Thermal Protection

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  • 4.6 Reserved or Unused Signals

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  • 4.7 Signal Groups

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  • 4.8 Test Access Port (TAP) Connection

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  • 4.9 DC Specifications

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    • 4.9.1 Flexible Motherboard Guidelines (FMB)

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    • 4.9.2 Voltage and Current Specifications

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    • 4.9.3 DC Specifications

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• 5 Mechanical Specifications and Ball Information

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  • 5.1 Mechanical Specifications

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    • 5.1.1 Mechanical Drawings

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    • 5.1.2 Loading Specifications

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  • 5.2 Processor Ballout Assignment

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• 6 Signal Quality Specifications

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  • 6.1 Signal Quality Specifications and Measurement Guidelines

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    • 6.1.1 Overshoot/Undershoot Guidelines

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    • 6.1.2 Overshoot/Undershoot Magnitude

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    • 6.1.3 Overshoot/Undershoot Pulse Duration

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• 7 Power Management

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  • 7.1 ACPI state Supported

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    • 7.1.1 System States

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    • 7.1.2 Processor Idle States

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    • 7.1.3 Integrated Graphics Display States

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    • 7.1.4 Integrated Memory Controller States

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    • 7.1.5 DMI States

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    • 7.1.6 Interface State Combinations

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  • 7.2 Processor Core Power Management

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    • 7.2.1 Enhanced Intel SpeedStep® Technology

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    • 7.2.2 Dynamic Cache Sizing

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    • 7.2.3 Low-Power Idle States

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    • 7.2.4 Graphics Power Management

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    • 7.2.5 Thread C-state Description

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    • 7.2.6 Processor Core/ C-states Description

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    • 7.2.7 Package C-States

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  • 7.3 IMC Power Management

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    • 7.3.1 Disabling Unused System Memory Outputs

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    • 7.3.2 DRAM Power Management and Initialization

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  • 7.4 DMI Power Management

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    • 7.4.1 Stop-Grant State

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    • 7.4.2 Stop-Grant Snoop State

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    • 7.4.3 Deep Sleep State

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    • 7.4.4 Deeper Sleep State

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    • 7.4.5 Extended Low-Power States

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• 8 Thermal Specifications and Design Considerations

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  • 8.1 Thermal Specifications

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    • 8.1.1 Intel® Thermal Monitor

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    • 8.1.2 Digital Thermal Sensor

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    • 8.1.3 Out of Specification Detection

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    • 8.1.4 PROCHOT# Signal Pin

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• 9 Testability

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  • 9.1 JTAG Boundary Scan

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  • 9.2 TAP Instructions and Opcodes

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• 10 Debug Tool Specifications

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