Scheda Tecnica (DF8064101055400)SommarioIntel® Atom™ Processor D2000 and N2000 Series1Revision History71 Introduction91.1 Intel® Atom™ Processor D2000 Series and N2000 Series Features91.2 System Memory Features101.3 Direct Media Interface Features111.4 Graphics Processing Unit Features111.5 Video121.6 Clocking131.7 Power Management131.7.1 Terminology141.8 References151.9 System Block Diagram161.9.1 PHOLD limitation on Legacy Feature162 Signal Description172.1 CPU Legacy Signal182.2 System Memory Interface202.3 DMI - Direct Media Interface222.4 PLL Signals232.5 Analog Display Signals232.6 LVDS Signals242.7 DDI Audio Interface252.8 DDI Port 0272.9 DDI Port1282.10 JTAG/ITP Signals282.11 Error and Thermal Protection292.12 Processor Core Power Signals292.13 Graphics, DMI and Memory Core Power Signals302.14 Ground313 Functional Description323.1 System Memory Controller323.1.1 System Memory Organization Modes323.1.2 System Memory Technology Supported323.1.3 Rules for populating DIMM Slots343.2 Graphics Processing Unit343.2.1 3-D Core Key Features343.2.2 2D Engine383.2.3 Analog Display Port Characteristics393.2.4 Digital Display Interfaces403.2.5 Multiple Display Configurations463.3 Thermal Sensor463.3.1 PCI Device 0, Function 0463.4 Power Management473.4.1 Interface Power States Supported473.4.2 Intel® Hyper-Threading Technology474 Electrical Specifications484.1 Power and Ground Balls484.2 Decoupling Guidelines484.2.1 Voltage Rail Decoupling484.3 Processor Clocking494.3.1 PLL Power Supply494.4 Voltage Identification (VID)504.5 Catastrophic Thermal Protection564.6 Reserved or Unused Signals564.7 Signal Groups574.8 Test Access Port (TAP) Connection574.9 DC Specifications574.9.1 Flexible Motherboard Guidelines (FMB)574.9.2 Voltage and Current Specifications584.9.3 DC Specifications645 Mechanical Specifications and Ball Information745.1 Mechanical Specifications745.1.1 Mechanical Drawings745.1.2 Loading Specifications755.2 Processor Ballout Assignment756 Signal Quality Specifications946.1 Signal Quality Specifications and Measurement Guidelines946.1.1 Overshoot/Undershoot Guidelines946.1.2 Overshoot/Undershoot Magnitude956.1.3 Overshoot/Undershoot Pulse Duration957 Power Management977.1 ACPI state Supported977.1.1 System States977.1.2 Processor Idle States977.1.3 Integrated Graphics Display States987.1.4 Integrated Memory Controller States987.1.5 DMI States987.1.6 Interface State Combinations997.2 Processor Core Power Management997.2.1 Enhanced Intel SpeedStep® Technology1007.2.2 Dynamic Cache Sizing1007.2.3 Low-Power Idle States1017.2.4 Graphics Power Management1037.2.5 Thread C-state Description1057.2.6 Processor Core/ C-states Description1067.2.7 Package C-States1077.3 IMC Power Management1107.3.1 Disabling Unused System Memory Outputs1107.3.2 DRAM Power Management and Initialization1117.4 DMI Power Management1127.4.1 Stop-Grant State1127.4.2 Stop-Grant Snoop State1137.4.3 Deep Sleep State1137.4.4 Deeper Sleep State1137.4.5 Extended Low-Power States1138 Thermal Specifications and Design Considerations1158.1 Thermal Specifications1158.1.1 Intel® Thermal Monitor1168.1.2 Digital Thermal Sensor1188.1.3 Out of Specification Detection1198.1.4 PROCHOT# Signal Pin1199 Testability1209.1 JTAG Boundary Scan1209.2 TAP Instructions and Opcodes12110 Debug Tool Specifications122Dimensioni: 1,09 MBPagine: 122Language: EnglishApri il manuale