用户手册 — Intel D2500

目录

• Intel® Atom™ Processor D2000 and N2000 Series

  1
• Revision History

  7
• 1 Introduction

  9
  • 1.1 Intel® Atom™ Processor D2000 Series and N2000 Series Features

    9
  • 1.2 System Memory Features

    10
  • 1.3 Direct Media Interface Features

    11
  • 1.4 Graphics Processing Unit Features

    11
  • 1.5 Video

    12
  • 1.6 Clocking

    13
  • 1.7 Power Management

    13
    • 1.7.1 Terminology

      14
  • 1.8 References

    15
  • 1.9 System Block Diagram

    16
    • 1.9.1 PHOLD limitation on Legacy Feature

      16
• 2 Signal Description

  17
  • 2.1 CPU Legacy Signal

    18
  • 2.2 System Memory Interface

    20
  • 2.3 DMI - Direct Media Interface

    22
  • 2.4 PLL Signals

    23
  • 2.5 Analog Display Signals

    23
  • 2.6 LVDS Signals

    24
  • 2.7 DDI Audio Interface

    25
  • 2.8 DDI Port 0

    27
  • 2.9 DDI Port1

    28
  • 2.10 JTAG/ITP Signals

    28
  • 2.11 Error and Thermal Protection

    29
  • 2.12 Processor Core Power Signals

    29
  • 2.13 Graphics, DMI and Memory Core Power Signals

    30
  • 2.14 Ground

    31
• 3 Functional Description

  32
  • 3.1 System Memory Controller

    32
    • 3.1.1 System Memory Organization Modes

      32
    • 3.1.2 System Memory Technology Supported

      32
    • 3.1.3 Rules for populating DIMM Slots

      34
  • 3.2 Graphics Processing Unit

    34
    • 3.2.1 3-D Core Key Features

      34
    • 3.2.2 2D Engine

      38
    • 3.2.3 Analog Display Port Characteristics

      39
    • 3.2.4 Digital Display Interfaces

      40
    • 3.2.5 Multiple Display Configurations

      46
  • 3.3 Thermal Sensor

    46
    • 3.3.1 PCI Device 0, Function 0

      46
  • 3.4 Power Management

    47
    • 3.4.1 Interface Power States Supported

      47
    • 3.4.2 Intel® Hyper-Threading Technology

      47
• 4 Electrical Specifications

  48
  • 4.1 Power and Ground Balls

    48
  • 4.2 Decoupling Guidelines

    48
    • 4.2.1 Voltage Rail Decoupling

      48
  • 4.3 Processor Clocking

    49
    • 4.3.1 PLL Power Supply

      49
  • 4.4 Voltage Identification (VID)

    50
  • 4.5 Catastrophic Thermal Protection

    56
  • 4.6 Reserved or Unused Signals

    56
  • 4.7 Signal Groups

    57
  • 4.8 Test Access Port (TAP) Connection

    57
  • 4.9 DC Specifications

    57
    • 4.9.1 Flexible Motherboard Guidelines (FMB)

      57
    • 4.9.2 Voltage and Current Specifications

      58
    • 4.9.3 DC Specifications

      64
• 5 Mechanical Specifications and Ball Information

  74
  • 5.1 Mechanical Specifications

    74
    • 5.1.1 Mechanical Drawings

      74
    • 5.1.2 Loading Specifications

      75
  • 5.2 Processor Ballout Assignment

    75
• 6 Signal Quality Specifications

  94
  • 6.1 Signal Quality Specifications and Measurement Guidelines

    94
    • 6.1.1 Overshoot/Undershoot Guidelines

      94
    • 6.1.2 Overshoot/Undershoot Magnitude

      95
    • 6.1.3 Overshoot/Undershoot Pulse Duration

      95
• 7 Power Management

  97
  • 7.1 ACPI state Supported

    97
    • 7.1.1 System States

      97
    • 7.1.2 Processor Idle States

      97
    • 7.1.3 Integrated Graphics Display States

      98
    • 7.1.4 Integrated Memory Controller States

      98
    • 7.1.5 DMI States

      98
    • 7.1.6 Interface State Combinations

      99
  • 7.2 Processor Core Power Management

    99
    • 7.2.1 Enhanced Intel SpeedStep® Technology

      100
    • 7.2.2 Dynamic Cache Sizing

      100
    • 7.2.3 Low-Power Idle States

      101
    • 7.2.4 Graphics Power Management

      103
    • 7.2.5 Thread C-state Description

      105
    • 7.2.6 Processor Core/ C-states Description

      106
    • 7.2.7 Package C-States

      107
  • 7.3 IMC Power Management

    110
    • 7.3.1 Disabling Unused System Memory Outputs

      110
    • 7.3.2 DRAM Power Management and Initialization

      111
  • 7.4 DMI Power Management

    112
    • 7.4.1 Stop-Grant State

      112
    • 7.4.2 Stop-Grant Snoop State

      113
    • 7.4.3 Deep Sleep State

      113
    • 7.4.4 Deeper Sleep State

      113
    • 7.4.5 Extended Low-Power States

      113
• 8 Thermal Specifications and Design Considerations

  115
  • 8.1 Thermal Specifications

    115
    • 8.1.1 Intel® Thermal Monitor

      116
    • 8.1.2 Digital Thermal Sensor

      118
    • 8.1.3 Out of Specification Detection

      119
    • 8.1.4 PROCHOT# Signal Pin

      119
• 9 Testability

  120
  • 9.1 JTAG Boundary Scan

    120
  • 9.2 TAP Instructions and Opcodes

    121
• 10 Debug Tool Specifications

  122