데이터 시트 (M95M02-DRMN6TP)차례1 Description6Figure 1. Logic diagram6Table 1. Signal names6Figure 2. 8-pin package connections (top view)7Figure 3. WLCSP connections (bump side view)72 Memory organization8Figure 4. Block diagram83 Signal description93.1 Serial Data Output (Q)93.2 Serial Data Input (D)93.3 Serial Clock (C)93.4 Chip Select (S)93.5 Hold (HOLD)93.6 Write Protect (W)103.7 VCC supply voltage103.8 VSS ground104 Connecting to the SPI bus11Figure 5. Bus master and memory devices on the SPI bus114.1 SPI modes12Figure 6. SPI modes supported125 Operating features135.1 Supply voltage (VCC)135.1.1 Operating supply voltage VCC135.1.2 Device reset135.1.3 Power-up conditions135.1.4 Power-down145.2 Active Power and Standby Power modes145.3 Hold condition14Figure 7. Hold condition activation145.4 Status Register155.5 Data protection and protocol control15Table 2. Write-protected block size156 Instructions16Table 3. M95M02-DR instruction set166.1 Write Enable (WREN)17Figure 8. Write Enable (WREN) sequence176.2 Write Disable (WRDI)17Figure 9. Write Disable (WRDI) sequence186.3 Read Status Register (RDSR)18Figure 10. Read Status Register (RDSR) sequence186.3.1 WIP bit186.3.2 WEL bit196.3.3 BP1, BP0 bits196.3.4 SRWD bit19Table 4. Status Register format196.4 Write Status Register (WRSR)20Figure 11. Write Status Register (WRSR) sequence20Table 5. Protection modes216.5 Read from Memory Array (READ)22Figure 12. Read from Memory Array (READ) sequence226.6 Write to Memory Array (WRITE)22Figure 13. Byte Write (WRITE) sequence23Figure 14. Page Write (WRITE) sequence246.6.1 Cycling with Error Correction Code (ECC)246.7 Read Identification Page25Figure 15. Read Identification Page sequence256.8 Write Identification Page26Figure 16. Write identification page sequence266.9 Read Lock Status27Figure 17. Read Lock Status sequence276.10 Lock ID28Figure 18. Lock ID sequence287 Power-up and delivery state297.1 Power-up state297.2 Initial delivery state298 Maximum rating30Table 6. Absolute maximum ratings309 DC and AC parameters31Table 7. Operating conditions (M95M02-DR, device grade 6)31Table 8. AC measurement conditions31Figure 19. AC measurement I/O waveform31Table 9. Capacitance32Table 10. Cycling performance by groups of four bytes32Table 11. Memory cell data retention32Table 12. DC characteristics33Table 13. AC characteristics34Figure 20. Serial input timing35Figure 21. Hold timing35Figure 22. Serial output timing3610 Package mechanical data37Figure 23. SO8N – 8-lead plastic small outline, 150 mils body width, package outline37Table 14. SO8N – 8-lead plastic small outline, 150 mils body width, mechanical data37Figure 24. M95M02-DRCS6TP/K, WLCSP standard package outline, bump side view38Table 15. M95M02-DRCS6TP/K, WLCSP package mechanical data3811 Part numbering39Table 16. Ordering information scheme3912 Revision history40Table 17. Document revision history40크기: 1.23메가바이트페이지: 41Language: English매뉴얼 열기