Intel Xeon X3450 BX80605X3450 Manual Do Utilizador

72

Intel® Xeon® Processor 3400 Series Datasheet, Volume 1

1.

Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2.

V

IL

 is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.

3.

V

IH

 is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value.

4.

V

IH

 and V

OH

 may experience excursions above V

DDQ

. However, input signal drivers must comply with the signal quality 

specifications.

5.

This is the pull down driver resistance. 

6.

R

VTT_TERM

 is the termination on the DIMM and in not controlled by the processor.

7.

COMP resistance must be provided on the system board with 1% resistors. COMP resistors are to V

SS

.

V

IL

Input Low Voltage

(e,f)

—

—

0.43*V

DDQ

V

2,4

V

IH

Input High Voltage

(e,f)

0.57*V

DDQ

—

—

V

3

V

OL

Output Low Voltage

(c,d,e,f)

—

(V

DDQ

 / 2)* (R

ON 

/(R

ON

+R

VTT_TERM

))

—

6

V

OH

Output High Voltage

(c,d,e,f)

—

V

DDQ

 – ((V

DDQ

 / 2)* 

(R

ON

/(R

ON

+R

VTT_TERM

))

—

V

4,6

R

ON

DDR3 Clock Buffer On 

Resistance

—

21

—

36

Ω

5

R

ON

DDR3 Command Buffer On 

Resistance

—

20

—

31

Ω

5

R

ON

DDR3 Control Buffer On 

Resistance

—

20

—

31

Ω

5

R

ON

DDR3 Data Buffer On 

Resistance

—

21

—

36

Ω

5

Data ODT

On-Die Termination for 

Data Signals

(d)

93.5

—

126.5

Ω

I

LI

Input Leakage Current

—

—

—

± 1

mA

SM_RCOMP0

COMP Resistance

(t)

99

100

101

Ω

7

SM_RCOMP1

COMP Resistance

(t)

24.7

24.9

25.1

Ω

7

SM_RCOMP2

COMP Resistance

(t)

128.7

130

131.3

Ω

7